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MAX3393EEUD+
Maxim Integrated Products
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$4.8929 | Yes | Yes | Transferred | 1.8 V | 3.3 V | OPEN-DRAIN | 1 | VOLTAGE LEVEL TRANSLATOR | BICMOS | 1.6 µs | 4 | LATCH | TRUE | 300 µA | 5.5 V | 1.2 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | R-PDSO-G14 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 5 mm | 1.1 mm | 4.4 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | TSSOP, TSSOP14,.25 | 14 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX3393EEUD-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | INTERFACE CIRCUIT | BICMOS | USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION | 4 | 5.5 V | 1.65 V | YES | INDUSTRIAL | R-PDSO-G14 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 5 mm | 1.1 mm | 4.4 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | 4.40 MM, MO-153AB-1, TSSOP-14 | 14 | not_compliant | 8542.39.00.01 | |||||||||||||||||
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MAX3393EEBC-T
Rochester Electronics LLC
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Check for Price | No | Active | 3.3 V | 3.3 V | INTERFACE CIRCUIT | BICMOS | USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION | 4 | 5.5 V | 1.2 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | R-PBGA-B12 | COMMERCIAL | 1 | 85 °C | -40 °C | 240 | 20 | 12 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | NOT SPECIFIED | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | ROCHESTER ELECTRONICS LLC | BGA | 1.50 X 2 MM, UCSP-12 | 12 | unknown | ||||||||||||||||
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MAX3393EEUD+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 1.8 V | 3.3 V | INTERFACE CIRCUIT | BICMOS | USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION | 4 | 5.5 V | 1.2 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | R-PDSO-G14 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 5 mm | 1.1 mm | 4.4 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | TSSOP, TSSOP14,.25 | 14 | compliant | EAR99 | 8542.39.00.01 | |||||||||||
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MAX3393EEUD
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | INTERFACE CIRCUIT | BICMOS | USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION | 4 | 5.5 V | 1.65 V | YES | INDUSTRIAL | R-PDSO-G14 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 5 mm | 1.1 mm | 4.4 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | TSSOP, TSSOP14,.25 | 14 | not_compliant | 8542.39.00.01 | |||||||||||||||||
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MAX3393EEUD+
Analog Devices Inc
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Check for Price | Yes | Active | 1.8 V | 3.3 V | OPEN-DRAIN | 1 | VOLTAGE LEVEL TRANSLATOR | BICMOS | 4 | LATCH | TRUE | 300 µA | 5.5 V | 1.2 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | R-PDSO-G14 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 5 mm | 1.1 mm | 4.4 mm | 14-TSSOP_4.4-4.4_MM | 14 | 14-TSSOP_4.4-4.4_MM | 2002-01-03 | Analog Devices | ||||||||||
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MAX3393EEBC
Maxim Integrated Products
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Check for Price | No | No | Obsolete | INTERFACE CIRCUIT | BICMOS | YES | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 12 | PLASTIC/EPOXY | FBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | TIN LEAD | BALL | 500 µm | BOTTOM | MAXIM INTEGRATED PRODUCTS INC | not_compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||
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MAX3393EETD
Maxim Integrated Products
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Check for Price | No | No | Transferred | 3.3 V | 3.3 V | INTERFACE CIRCUIT | BICMOS | USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION | 4 | 5.5 V | 1.2 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | S-XDSO-N8 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 8 | UNSPECIFIED | HVSON | SOLCC14,.12,16 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 650 µm | DUAL | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SON | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 | 8 | not_compliant | 8542.39.00.01 | ||||||||||||||
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MAX3393EEBC-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | 3.3 V | INTERFACE CIRCUIT | BICMOS | USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION | 4 | 5.5 V | 1.2 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN LEAD | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 1.50 X 2 MM, UCSP-12 | 12 | not_compliant | 8542.39.00.01 | ||||||||||||||
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MAX3393EETD+T
Maxim Integrated Products
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Check for Price | Yes | Transferred | 1.8 V | 3.3 V | OPEN-DRAIN | 1 | VOLTAGE LEVEL TRANSLATOR | BICMOS | 1.6 µs | 4 | LATCH | TRUE | 300 µA | 5.5 V | 1.2 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | S-PDSO-N14 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 14 | UNSPECIFIED | HVSON | SOLCC14,.12,16 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 400 µm | DUAL | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | DFN | HVSON, SOLCC14,.12,16 | 14 | compliant | 8542.39.00.01 |