Parametric results for: max3736ete under Other Interface ICs

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Manufacturer Part Number: max3736ete
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MAX3736ETE
Maxim Integrated Products
$6.1165 No No Obsolete 3.3 V INTERFACE CIRCUIT BIPOLAR 1 3.63 V 2.97 V YES INDUSTRIAL S-XQCC-N16 Not Qualified e0 1 85 °C -40 °C 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TIN LEAD NO LEAD 500 µm QUAD 3 mm 800 µm 3 mm MAXIM INTEGRATED PRODUCTS INC QFN HVQCCN, LCC16,.12SQ,20 16 not_compliant EAR99 8542.39.00.01
MAX3736ETE+
Maxim Integrated Products
$6.4857 Yes Yes Transferred 3.3 V INTERFACE CIRCUIT BIPOLAR 1 3.63 V 2.97 V YES INDUSTRIAL S-XQCC-N16 Not Qualified e3 1 85 °C -40 °C 260 30 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 3 mm 800 µm 3 mm MAXIM INTEGRATED PRODUCTS INC QFN 3 X 3 MM, ROHS COMPLIANT, TQFN-16 16 compliant EAR99 8542.39.00.01
MAX3736ETE+
Analog Devices Inc
$12.5962 Yes Not Recommended 3.3 V INTERFACE CIRCUIT BIPOLAR 1 3.63 V 2.97 V YES INDUSTRIAL S-XQCC-N16 Not Qualified e3 1 85 °C -40 °C 260 30 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 3 mm 800 µm 3 mm ANALOG DEVICES INC 16-LFCSP-3X3X0.75 3 X 3 MM, ROHS COMPLIANT, TQFN-16 16 compliant 16-LFCSP-3X3X0.75 2004-02-03 Analog Devices
MAX3736ETE+T
Analog Devices Inc
Check for Price Yes Not Recommended 3.3 V INTERFACE CIRCUIT BIPOLAR 1 3.63 V 2.97 V YES INDUSTRIAL S-XQCC-N16 Not Qualified e3 1 85 °C -40 °C 260 30 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 3 mm 800 µm 3 mm ANALOG DEVICES INC 16-LFCSP-3X3X0.75 3 X 3 MM, TQFN-16 16 compliant 16-LFCSP-3X3X0.75 2004-02-03 Analog Devices
MAX3736ETE-T
Maxim Integrated Products
Check for Price No No Obsolete 3.3 V INTERFACE CIRCUIT BIPOLAR 1 3.63 V 2.97 V YES INDUSTRIAL S-XQCC-N16 Not Qualified e0 1 85 °C -40 °C 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TIN LEAD NO LEAD 500 µm QUAD 3 mm 800 µm 3 mm MAXIM INTEGRATED PRODUCTS INC QFN 3 X 3 MM, TQFN-16 16 compliant EAR99 8542.39.00.01
MAX3736ETE+T
Maxim Integrated Products
Check for Price Yes Yes Transferred 3.3 V INTERFACE CIRCUIT BIPOLAR 1 3.63 V 2.97 V YES INDUSTRIAL S-XQCC-N16 Not Qualified e3 1 85 °C -40 °C 260 30 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 3 mm 800 µm 3 mm MAXIM INTEGRATED PRODUCTS INC QFN 3 X 3 MM, TQFN-16 16 compliant EAR99 8542.39.00.01
MAX3736ETE
Rochester Electronics LLC
Check for Price No Active 3.3 V INTERFACE CIRCUIT BIPOLAR 1 3.63 V 2.97 V YES INDUSTRIAL S-XQCC-N16 COMMERCIAL e0 1 85 °C -40 °C 245 NOT SPECIFIED 16 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TIN LEAD NO LEAD 500 µm QUAD 3 mm 800 µm 3 mm ROCHESTER ELECTRONICS LLC QFN 3 X 3 MM, TQFN-16 16 unknown