Parametric results for: max3765cub under Other Telecom ICs
Filter Your Search
1 - 5 of 5 results
|
Select parts from the table below to compare.
Compare
Compare
|
MAX3765CUB+T
Maxim Integrated Products
|
Check for Price | Yes | Yes | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 76 µA | COMMERCIAL | S-PDSO-G10 | e3 | Not Qualified | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | HTSSOP, TSSOP10,.19,20 | 10 | compliant | EAR99 | 8542.33.00.01 | ||
|
|
MAX3765CUB
Rochester Electronics LLC
|
Check for Price | No | No | Active | 3.3 V | TELECOM CIRCUIT | 1 | COMMERCIAL | S-PDSO-G10 | e0 | COMMERCIAL | 1 | 70 °C | 245 | NOT SPECIFIED | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | ROCHESTER ELECTRONICS LLC | TSSOP | EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | 10 | unknown | |||||||
|
|
MAX3765CUB
Maxim Integrated Products
|
Check for Price | No | No | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 90 µA | COMMERCIAL | S-PDSO-G10 | e0 | Not Qualified | 1 | 70 °C | 240 | 20 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | 10 | not_compliant | 8542.39.00.01 | |||
|
|
MAX3765CUB-T
Maxim Integrated Products
|
Check for Price | No | No | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 76 µA | COMMERCIAL | S-PDSO-G10 | e0 | Not Qualified | 1 | 70 °C | 240 | 20 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | 10 | not_compliant | 8542.39.00.01 | |||
|
|
MAX3765CUB+
Maxim Integrated Products
|
Check for Price | Yes | Yes | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 90 µA | COMMERCIAL | S-PDSO-G10 | e3 | Not Qualified | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | HTSSOP, TSSOP10,.19,20 | 10 | compliant | EAR99 | 8542.33.00.01 |