Parametric results for: max3982 under Other Interface ICs
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MAX3982UTE+
Maxim Integrated Products
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$8.8570 | Yes | Yes | Transferred | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.6 V | 3 V | YES | OTHER | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX3982UTE
Rochester Electronics LLC
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Check for Price | No | Active | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.6 V | 3 V | YES | OTHER | S-XQCC-N16 | COMMERCIAL | e0 | 1 | 85 °C | 245 | NOT SPECIFIED | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | ROCHESTER ELECTRONICS LLC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, MO-220, TQFN-16 | 16 | unknown | |||||||||
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MAX3982UTE+T
Analog Devices Inc
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Check for Price | Yes | Not Recommended | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.6 V | 3 V | YES | S-XQCC-N16 | e3 | 1 | 85 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | 16-LFCSP-3X3X0.75 | 16 | 16-LFCSP-3X3X0.75 | 2004-08-12 | |||||||||||
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MAX3982UTE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.6 V | 3 V | YES | OTHER | S-XQCC-N16 | Not Qualified | e0 | 1 | 85 °C | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 16 | not_compliant | 8542.39.00.01 | |||||||||
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MAX3982UTE+
Analog Devices Inc
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Check for Price | Yes | Not Recommended | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.6 V | 3 V | YES | S-XQCC-N16 | e3 | 1 | 85 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | 16-LFCSP-3X3X0.75 | 16 | 16-LFCSP-3X3X0.75 | 2004-08-12 | Analog Devices | ||||||||||
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MAX3982UTE+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.6 V | 3 V | YES | OTHER | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX3982UTE
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | INTERFACE CIRCUIT | BIPOLAR | 1 | 3.6 V | 3 V | YES | OTHER | S-XQCC-N16 | Not Qualified | e0 | 1 | 85 °C | 245 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 16 | not_compliant | EAR99 | 8542.39.00.01 |