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MAX4734EUB+
Maxim Integrated Products
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$2.7185 | Yes | Yes | Transferred | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | 3 X 3 MM, ROHS COMPLIANT, MO-187CBA, MICRO, SOP-10 | 10 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX4734ETC+
Maxim Integrated Products
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$2.7563 | Yes | Yes | Transferred | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | HVQCCN | LCC12,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80MM HEIGHT, ROHS COMPLIANT, MO-220WEED-1, TQFN-12 | 12 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX4734EUB+T
Maxim Integrated Products
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$3.3723 | Yes | Yes | Transferred | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | TSSOP, TSSOP10,.19,20 | 10 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX4734ETC
Maxim Integrated Products
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Check for Price | No | No | Transferred | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PQCC-N12 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 12 | PLASTIC/EPOXY | HVQCCN | LCC12,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC12,.12SQ,20 | 12 | not_compliant | 8542.39.00.01 | |||||||
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MAX4734EUB+T
Analog Devices Inc
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Check for Price | Yes | Active | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | 10-MINI_SO-N/A | 10 | 10-MINI_SO-N/A | 2002-05-10 | Analog Devices | ||||||||
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MAX4734EUB-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-G10 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | 3 X 3 MM, MO-187CBA, MICRO, SOP-10 | 10 | not_compliant | 8542.39.00.01 | |||||||
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MAX4734EGC+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | VQCCN | LCC12,.12SQ,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 900 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | VQCCN, LCC12,.12SQ,20 | 12 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX4734EU
Maxim Integrated Products
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Check for Price | No | No | Transferred | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-G10 | Not Qualified | e0 | 85 °C | -40 °C | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | TSSOP, TSSOP10,.19,20 | 10 | not_compliant | 8542.39.00.01 | |||||||||
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MAX4734ETC+
Analog Devices Inc
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Check for Price | Yes | Active | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | HVQCCN | LCC12,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | ANALOG DEVICES INC | 12-LFCSP-3X3X0.75 | 3 X 3 MM, 0.80MM HEIGHT, ROHS COMPLIANT, MO-220WEED-1, TQFN-12 | 12 | compliant | 12-LFCSP-3X3X0.75 | 2002-05-10 | Analog Devices | |||||
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MAX4734EUB+
Analog Devices Inc
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Check for Price | Yes | Active | 1.8 V | YES | 2 Ω | 30 ns | 25 ns | 150 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 1 | 56 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | 10-MINI_SO-N/A | 3 X 3 MM, ROHS COMPLIANT, MO-187CBA, MICRO, SOP-10 | 10 | compliant | 10-MINI_SO-N/A | 2002-05-10 | Analog Devices |