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Parametric » Drivers And Interfaces » Other Interface ICs

Parametric results for: max7304etg+ under Other Interface ICs

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Select Parts		Part Number

		MAX7304ETG+ Maxim Integrated Products
		MAX7304ETG+ Analog Devices Inc
		MAX7304ETG+T Analog Devices Inc
		MAX7304ETG+T Maxim Integrated Products

				Most Relevant	Technical							Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Interface IC Type	Technology	Number of Functions	Supply Voltage-Max	Supply Voltage-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer

Check for Price

Yes

Yes

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.62 V

YES

INDUSTRIAL

S-PDSO-N24

Not Qualified

e3

1

85 °C

-40 °C

260

30

24

PLASTIC/EPOXY

VSON

LCC24,.14SQ,16

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

MATTE TIN

NO LEAD

400 µm

DUAL

3.5 mm

850 µm

3.5 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

VSON, LCC24,.14SQ,16

24

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.62 V

YES

INDUSTRIAL

S-PDSO-N24

Not Qualified

e3

1

85 °C

-40 °C

260

30

24

PLASTIC/EPOXY

VSON

LCC24,.14SQ,16

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

Matte Tin (Sn) - annealed

NO LEAD

400 µm

DUAL

3.5 mm

850 µm

3.5 mm

24-LFCSP-3.5X3.5X0.75

24

24-LFCSP-3.5X3.5X0.75

2011-07-20

Analog Devices

Check for Price

Yes

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.62 V

YES

INDUSTRIAL

S-PDSO-N24

e3

1

85 °C

-40 °C

260

30

24

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

400 µm

DUAL

3.5 mm

850 µm

3.5 mm

24-LFCSP-3.5X3.5X0.75

24

24-LFCSP-3.5X3.5X0.75

2011-07-20

Analog Devices

Check for Price

Yes

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.62 V

YES

INDUSTRIAL

S-PDSO-N24

e3

1

85 °C

-40 °C

260

30

24

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

400 µm

DUAL

3.5 mm

850 µm

3.5 mm

MAXIM INTEGRATED PRODUCTS INC

HVSON,

compliant

EAR99

8542.39.00.01

Compare

Drivers And Interfaces

Maxim Integrated Products

Check for Price

Yes

Yes

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.62 V

YES

INDUSTRIAL

S-PDSO-N24

Not Qualified

e3

1

85 °C

-40 °C

260

30

24

PLASTIC/EPOXY

VSON

LCC24,.14SQ,16

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

MATTE TIN

NO LEAD

400 µm

DUAL

3.5 mm

850 µm

3.5 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

VSON, LCC24,.14SQ,16

24

compliant

EAR99

8542.39.00.01

Analog Devices Inc

Check for Price

Yes

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.62 V

YES

INDUSTRIAL

S-PDSO-N24

Not Qualified

e3

1

85 °C

-40 °C

260

30

24

PLASTIC/EPOXY

VSON

LCC24,.14SQ,16

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

Matte Tin (Sn) - annealed

NO LEAD

400 µm

DUAL

3.5 mm

850 µm

3.5 mm

24-LFCSP-3.5X3.5X0.75

24

24-LFCSP-3.5X3.5X0.75

2011-07-20

Analog Devices

Analog Devices Inc

Check for Price

Yes

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.62 V

YES

INDUSTRIAL

S-PDSO-N24

e3

1

85 °C

-40 °C

260

30

24

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

400 µm

DUAL

3.5 mm

850 µm

3.5 mm

24-LFCSP-3.5X3.5X0.75

24

24-LFCSP-3.5X3.5X0.75

2011-07-20

Analog Devices

Maxim Integrated Products

Check for Price

Yes

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

1.62 V

YES

INDUSTRIAL

S-PDSO-N24

e3

1

85 °C

-40 °C

260

30

24

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

400 µm

DUAL

3.5 mm

850 µm

3.5 mm

MAXIM INTEGRATED PRODUCTS INC

HVSON,

compliant

EAR99

8542.39.00.01