Parametric results for: max7323 under Parallel IO Ports
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MAX7323AEE+
Maxim Integrated Products
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$2.4399 | Yes | Yes | Transferred | 8 | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | MATTE TIN | GULL WING | 635 µm | DUAL | 1.75 mm | 3.9 mm | 4.89 mm | MAXIM INTEGRATED PRODUCTS INC | SSOP | 0.150 INCH, 0.025 INCH PITCH, ROHS COMPLIANT, MO-137, QSOP-16 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX7323ATE+
Maxim Integrated Products
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$3.7040 | Yes | Yes | Transferred | 8 | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX7323ATE+
Rochester Electronics LLC
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Check for Price | Yes | Active | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | COMMERCIAL | e3 | 1 | 125 °C | -40 °C | 260 | NOT SPECIFIED | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | ROCHESTER ELECTRONICS LLC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 | 16 | unknown | ||||||||||||
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MAX7323ATE+
Analog Devices Inc
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Check for Price | Yes | Active | 8 | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | ANALOG DEVICES INC | 16-LFCSP-3X3X0.75 | 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 | 16 | compliant | 16-LFCSP-3X3X0.75 | 2007-09-18 | Analog Devices | ||||||
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MAX7323ATE+T
Analog Devices Inc
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Check for Price | Yes | Active | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | ANALOG DEVICES INC | 16-LFCSP-3X3X0.75 | 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 | 16 | compliant | 16-LFCSP-3X3X0.75 | 2007-09-18 | Analog Devices | ||||||||
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MAX7323AEE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 8 | 400 kHz | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | TIN LEAD | GULL WING | 635 µm | DUAL | 1.75 mm | 3.9 mm | 4.89 mm | MAXIM INTEGRATED PRODUCTS INC | SSOP | SSOP, SSOP16,.25 | 16 | not_compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX7323AEE
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 8 | 400 kHz | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | TIN LEAD | GULL WING | 635 µm | DUAL | 1.75 mm | 3.9 mm | 4.89 mm | MAXIM INTEGRATED PRODUCTS INC | SSOP | SSOP, SSOP16,.25 | 16 | not_compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX7323ATE+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||||
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MAX7323ATE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 8 | 400 kHz | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | not_compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX7323AEE+T
Analog Devices Inc
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Check for Price | Yes | Active | 8 | 4 | YES | 3.3 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 1 | 5.5 V | 1.71 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 635 µm | DUAL | 1.75 mm | 3.9 mm | 4.89 mm | 16-QSOP-150_MIL | 16 | 16-QSOP-150_MIL | 2007-09-18 | Analog Devices |