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Parametric » Telecommunication Circuits » Other Telecom ICs

Parametric results for: mb86977 under Other Telecom ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		MB86977PFV-G-BND FUJITSU Limited
		MB86977PFV-G-BND Cypress Semiconductor
		MB86977APFV-G-BND FUJITSU Semiconductor Limited
		MB86977APFV-G-BND FUJITSU Limited
		MB86977PFV-G-BND FUJITSU Semiconductor Limited

		Most Relevant			Technical			Compliance		Operating Conditions		Physical										Dimensions			Other
Composite Price	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count

Check for Price

Obsolete

1.8 V

TELECOM CIRCUIT

1

OTHER

S-PQFP-G208

Not Qualified

85 °C

-20 °C

208

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

GULL WING

500 µm

QUAD

28 mm

28 mm

1.7 mm

FUJITSU LTD

LFQFP,

compliant

8542.39.00.01

Check for Price

Transferred

1.8 V

TELECOM CIRCUIT

1

OTHER

S-PQFP-G208

85 °C

-20 °C

208

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

GULL WING

500 µm

QUAD

28 mm

28 mm

1.7 mm

CYPRESS SEMICONDUCTOR CORP

LFQFP,

compliant

8542.39.00.01

Check for Price

Obsolete

CMOS

700 mA

OTHER

S-PQFP-G208

Not Qualified

85 °C

-20 °C

208

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

FLATPACK

YES

GULL WING

500 µm

QUAD

FUJITSU LTD

QFP, QFP208,1.2SQ,20

compliant

8542.31.00.01

Check for Price

Obsolete

CMOS

700 mA

OTHER

S-PQFP-G208

Not Qualified

85 °C

-20 °C

208

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

FLATPACK

YES

GULL WING

500 µm

QUAD

FUJITSU LTD

QFP, QFP208,1.2SQ,20

compliant

8542.31.00.01

Check for Price

Obsolete

1.8 V

TELECOM CIRCUIT

1

OTHER

S-PQFP-G208

Not Qualified

85 °C

-20 °C

208

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

GULL WING

500 µm

QUAD

28 mm

28 mm

1.7 mm

FUJITSU LTD

LFQFP,

compliant

8542.39.00.01

QFP

208

Compare

MB86977PFV-G-BND

FUJITSU Limited

Check for Price

Obsolete

1.8 V

TELECOM CIRCUIT

1

OTHER

S-PQFP-G208

Not Qualified

85 °C

-20 °C

208

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

GULL WING

500 µm

QUAD

28 mm

28 mm

1.7 mm

FUJITSU LTD

LFQFP,

compliant

8542.39.00.01

MB86977PFV-G-BND

Cypress Semiconductor

Check for Price

Transferred

1.8 V

TELECOM CIRCUIT

1

OTHER

S-PQFP-G208

85 °C

-20 °C

208

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

GULL WING

500 µm

QUAD

28 mm

28 mm

1.7 mm

CYPRESS SEMICONDUCTOR CORP

LFQFP,

compliant

8542.39.00.01

MB86977APFV-G-BND

FUJITSU Semiconductor Limited

Check for Price

Obsolete

CMOS

700 mA

OTHER

S-PQFP-G208

Not Qualified

85 °C

-20 °C

208

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

FLATPACK

YES

GULL WING

500 µm

QUAD

FUJITSU LTD

QFP, QFP208,1.2SQ,20

compliant

8542.31.00.01

MB86977APFV-G-BND

FUJITSU Limited

Check for Price

Obsolete

CMOS

700 mA

OTHER

S-PQFP-G208

Not Qualified

85 °C

-20 °C

208

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

FLATPACK

YES

GULL WING

500 µm

QUAD

FUJITSU LTD

QFP, QFP208,1.2SQ,20

compliant

8542.31.00.01

Telecommunication Circuits

MB86977PFV-G-BND

FUJITSU Semiconductor Limited

Check for Price

Obsolete

1.8 V

TELECOM CIRCUIT

1

OTHER

S-PQFP-G208

Not Qualified

85 °C

-20 °C

208

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

GULL WING

500 µm

QUAD

28 mm

28 mm

1.7 mm

FUJITSU LTD

LFQFP,

compliant

8542.39.00.01

QFP

208