Parametric results for: mc2006 under Other Amplifiers
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MC2006S8
MACOM
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Check for Price | Active | M/A-COM TECHNOLOGY SOLUTIONS INC | , | compliant | EAR99 | 8542.33.00.01 | |||||||||||||||||||||||||||
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MC2006WAFERP
Mindspeed Technologies Inc
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Check for Price | Obsolete | 5 V | CMOS | TELECOM CIRCUIT | 1 | X-XUUC-N | Not Qualified | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | NO LEAD | UPPER | MINDSPEED TECHNOLOGIES INC | DIE, | compliant | 8542.39.00.01 | |||||||||||||||
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MC2006DIE
MACOM
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Check for Price | Obsolete | M/A-COM TECHNOLOGY SOLUTIONS INC | , | compliant | EAR99 | 8542.33.00.01 | |||||||||||||||||||||||||||
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MC2006WPDIE
Mindspeed Technologies Inc
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Check for Price | Obsolete | 5 V | CMOS | TELECOM CIRCUIT | 1 | R-XUUC-N8 | Not Qualified | 8 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | MINDSPEED TECHNOLOGIES INC | DIE, | compliant | 8542.39.00.01 | DIE | 8 | ||||||||||||
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MC2006L
Motorola Semiconductor Products
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Check for Price | No | Obsolete | TTL | COMMERCIAL | R-XDIP-T14 | e0 | Not Qualified | 70 °C | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA INC | unknown | 8542.39.00.01 | |||||||||||
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MC2006WAFERQSPBG
Mindspeed Technologies Inc
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Check for Price | Obsolete | 5 V | CMOS | TELECOM CIRCUIT | 1 | X-XUUC-N | Not Qualified | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | NO LEAD | UPPER | MINDSPEED TECHNOLOGIES INC | DIE, | compliant | 8542.39.00.01 | |||||||||||||||
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MC2006S8
Conexant Systems Inc
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Check for Price | No | Transferred | CMOS | TELECOM CIRCUIT | 1 | 35 µA | INDUSTRIAL | R-PDSO-G8 | e0 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | CONEXANT SYSTEMS | TSSOP, TSSOP8,.19 | compliant | 8542.39.00.01 | ||||||
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MC2006DIE
Mindspeed Technologies Inc
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Check for Price | Obsolete | 5 V | CMOS | TELECOM CIRCUIT | 1 | R-XUUC-N8 | Not Qualified | 8 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | MINDSPEED TECHNOLOGIES INC | DIE, | compliant | 8542.39.00.01 | DIE | 8 | ||||||||||||
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MC2006F
Freescale Semiconductor
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Check for Price | No | Obsolete | TTL | COMMERCIAL | R-XDFP-F14 | e0 | Not Qualified | 70 °C | 14 | CERAMIC | DFP | FL14,.3 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | MOTOROLA SEMICONDUCTOR PRODUCTS | DFP, FL14,.3 | unknown | |||||||||||
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MC2006WAFERSPBG
Mindspeed Technologies Inc
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Check for Price | Obsolete | 5 V | CMOS | TELECOM CIRCUIT | 1 | X-XUUC-N | Not Qualified | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | NO LEAD | UPPER | MINDSPEED TECHNOLOGIES INC | DIE, | compliant | 8542.39.00.01 |