Parametric results for: mc68hc000 under Microprocessors

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Manufacturer Part Number: mc68hc000
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MC68HC000FC20
Motorola Mobility LLC
Check for Price Obsolete 32 20 MHz 0 16 23 20 MHz YES 5 V MICROPROCESSOR CMOS NO FIXED POINT NO NO 7 70 mA 5.25 V 4.75 V COMMERCIAL S-PQFP-G68 Not Qualified 70 °C 68 PLASTIC/EPOXY BQFP SQUARE FLATPACK, BUMPER GULL WING 635 µm QUAD 3.04 mm 13.97 mm 13.97 mm MOTOROLA INC QFP BQFP, 68 unknown 8542.31.00.01
MC68HC000R12
Freescale Semiconductor
Check for Price No Obsolete 32 12.5 MHz NO 5 V MICROPROCESSOR, RISC CMOS 5 V 35 mA COMMERCIAL S-PPGA-P68 Not Qualified e0 70 °C 68 PLASTIC/EPOXY PGA PGA68,10X10 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) PIN/PEG 2.54 mm PERPENDICULAR MOTOROLA SEMICONDUCTOR PRODUCTS PGA, PGA68,10X10 unknown
MC68HC000RC12F
Motorola Mobility LLC
Check for Price Transferred 32 16.67 MHz 0 16 23 16.67 MHz NO 5 V MICROPROCESSOR CMOS NO FIXED POINT NO NO 7 50 mA 5.25 V 4.75 V COMMERCIAL S-CPGA-P68 Not Qualified e0 70 °C 68 CERAMIC, METAL-SEALED COFIRED PGA PGA68,10X10 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) PIN/PEG 2.54 mm PERPENDICULAR 5.16 mm 26.92 mm 26.92 mm MOTOROLA INC PGA PGA, PGA68,10X10 68 unknown 8542.31.00.01
MC68HC000L12F
Motorola Mobility LLC
Check for Price No Obsolete 32 16.67 MHz 0 16 24 16.67 MHz NO 5 V MICROPROCESSOR CMOS NO FIXED POINT NO NO 3 50 mA 5.25 V 4.75 V COMMERCIAL R-CDIP-T64 Not Qualified e0 70 °C 64 CERAMIC, METAL-SEALED COFIRED DIP DIP64,.9 RECTANGULAR IN-LINE TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.32 mm 22.86 mm 81.28 mm MOTOROLA INC DIP DIP, DIP64,.9 64 unknown 8542.31.00.01
MC68HC000CFN12
Freescale Semiconductor
Check for Price No No Obsolete 32 12.5 MHz YES 5 V MICROPROCESSOR, RISC CMOS 35 mA INDUSTRIAL S-PQCC-J68 Not Qualified e0 3 85 °C -40 °C 220 30 68 PLASTIC/EPOXY QCCJ LDCC68,1.0SQ SQUARE CHIP CARRIER TIN LEAD J BEND 1.27 mm QUAD FREESCALE SEMICONDUCTOR INC unknown 8542.31.00.01 EAR99
MC68HC000CLC12
Motorola Mobility LLC
Check for Price Obsolete 32 12 MHz 0 16 23 12 MHz NO 5 V MICROPROCESSOR CMOS NO FIXED POINT NO NO 7 35 mA 5.25 V 4.75 V INDUSTRIAL R-CDIP-T64 Not Qualified 85 °C -40 °C 64 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE THROUGH-HOLE 2.54 mm DUAL 4.32 mm 22.86 mm 81.28 mm MOTOROLA INC DIP DIP, 64 unknown 8542.31.00.01
MC68HC000FN16
Motorola Mobility LLC
Check for Price Transferred 32 16.67 MHz 0 16 23 16.67 MHz YES 5 V MICROPROCESSOR CMOS NO FIXED POINT NO NO 7 50 mA 5.25 V 4.75 V COMMERCIAL S-PQCC-J68 Not Qualified e0 70 °C 68 PLASTIC/EPOXY QCCJ LDCC68,1.0SQ SQUARE CHIP CARRIER Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 4.57 mm 24.2062 mm 24.2062 mm MOTOROLA INC LCC QCCJ, LDCC68,1.0SQ 68 unknown 8542.31.00.01
MC68HC000LC12
Motorola Mobility LLC
Check for Price No Obsolete 32 12 MHz 0 16 24 12 MHz NO 5 V MICROPROCESSOR CMOS NO FIXED POINT NO NO 7 35 mA 5.25 V 4.75 V COMMERCIAL R-CDIP-T64 Not Qualified e0 70 °C 64 CERAMIC, METAL-SEALED COFIRED DIP DIP64,.9 RECTANGULAR IN-LINE TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.32 mm 22.86 mm 81.28 mm MOTOROLA INC DIP DIP, DIP64,.9 64 unknown 8542.31.00.01
MC68HC000CR16
Motorola Semiconductor Products
Check for Price Obsolete 32 16.67 MHz 0 16 23 16.67 MHz NO 5 V MICROPROCESSOR CMOS NO FIXED POINT NO NO 7 50 mA 5.25 V 4.75 V INDUSTRIAL R-PDIP-T64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE THROUGH-HOLE 2.54 mm DUAL 5.84 mm 22.86 mm 81.535 mm MOTOROLA INC DIP, unknown 8542.31.00.01
MC68HC000FC12F
Motorola Semiconductor Products
Check for Price Obsolete 32 16.67 MHz 0 16 23 16.67 MHz YES 5 V MICROPROCESSOR CMOS NO FIXED POINT NO NO 7 50 mA 5.25 V 4.75 V COMMERCIAL S-PQFP-G68 Not Qualified 70 °C 68 PLASTIC/EPOXY BQFP SQUARE FLATPACK, BUMPER GULL WING 635 µm QUAD 3.04 mm 13.97 mm 13.97 mm MOTOROLA INC BQFP, unknown 8542.31.00.01