Parametric results for: mc9s08qg8cfk under Microcontrollers
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MC9S08QG8CFKE
Freescale Semiconductor
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$1.1200 | Yes | Yes | Transferred | 8 | 20 MHz | 8192 | 512 | 20 MHz | 14 | YES | 3 V | MICROCONTROLLER | CMOS | NO | NO | YES | 8 | YES | FLASH | 5 mA | 3.6 V | 1.8 V | INDUSTRIAL | S-XQCC-N24 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 1 mm | 4 mm | 4 mm | FREESCALE SEMICONDUCTOR INC | QFN | 4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VGGD-8, QFN-24 | 24 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||
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MC9S08QG8CFKE
NXP Semiconductors
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$1.9954 | Yes | Active | 8 | 20 MHz | 8192 | 512 | 20 MHz | 14 | YES | 3 V | MICROCONTROLLER | CMOS | NO | NO | YES | 8 | YES | FLASH | 5 mA | 3.6 V | 3 V | INDUSTRIAL | S-XQCC-N24 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin (Sn) | NO LEAD | 500 µm | QUAD | 1 mm | 4 mm | 4 mm | NXP SEMICONDUCTORS | 4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VGGD-8, QFN-24 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||
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MC9S08QG8CFKE
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 8 | 20 MHz | 20 MHz | 14 | YES | 3 V | MICROCONTROLLER | CMOS | NO | NO | YES | YES | FLASH | 3.6 V | 1.8 V | INDUSTRIAL | S-XQCC-N24 | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NOT SPECIFIED | NO LEAD | 500 µm | QUAD | 1 mm | 4 mm | 4 mm | ROCHESTER ELECTRONICS LLC | QFN | 4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VGGD-8, QFN-24 | 24 | unknown |