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Parametric results for: mcimx355 under Multifunction Peripherals

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18 hits
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18 hits
Manufacturer Part Number: mcimx355
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MCIMX355AJQ5CR2
 NXP Semiconductors 		$26.2450 Yes Active SoC e1 3 260 40 Tin/Silver/Copper (Sn/Ag/Cu) NXP SEMICONDUCTORS compliant 5A992.C 8542.31.00.01 NXP
MCIMX355AJQ5C
 NXP Semiconductors 		$26.2450 Yes Active YES 1.8 V SoC CMOS 1.47 V 1.33 V INDUSTRIAL S-PBGA-B400 Not Qualified e1 3 85 °C -40 °C 260 AEC-Q100 40 400 PLASTIC/EPOXY LFBGA BGA400,20X20,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.6 mm 17 mm 17 mm NXP SEMICONDUCTORS compliant 5A992.C 8542.31.00.01 NXP MABGA-400
MCIMX355AVM5B
 NXP Semiconductors 		$26.2450 Yes Active YES 1.8 V SoC CMOS 1.47 V 1.33 V INDUSTRIAL S-PBGA-B400 Not Qualified e1 3 85 °C -40 °C 260 AEC-Q100 40 400 PLASTIC/EPOXY LFBGA BGA400,20X20,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.6 mm 17 mm 17 mm NXP SEMICONDUCTORS compliant 5A992.C 8542.31.00.01 MABGA-400
MCIMX355AVM4B
 NXP Semiconductors 		$26.2450 Yes Active YES 1.8 V SoC CMOS 1.47 V 1.22 V INDUSTRIAL S-PBGA-B400 Not Qualified e1 3 85 °C -40 °C 260 AEC-Q100 40 400 PLASTIC/EPOXY LFBGA BGA400,20X20,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.6 mm 17 mm 17 mm NXP SEMICONDUCTORS compliant 5A992.C 8542.31.00.01 MABGA-400
935319538518
 NXP Semiconductors 		Check for Price Active SoC e1 3 260 40 TIN SILVER COPPER NXP SEMICONDUCTORS unknown 8542.39.00.01 ,
935319631557
 NXP Semiconductors 		Check for Price Active SoC NXP SEMICONDUCTORS unknown 8542.39.00.01 ,
MCIMX355AJQ4C
 Freescale Semiconductor 		Check for Price Transferred YES SoC INDUSTRIAL S-PBGA-B400 Not Qualified 400 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.6 mm 17 mm 17 mm FREESCALE SEMICONDUCTOR INC unknown 8542.39.00.01 LFBGA, BGA 400
MCIMX355AJQ4C
 NXP Semiconductors 		Check for Price Active YES 1.8 V SoC CMOS 1.47 V 1.22 V INDUSTRIAL S-PBGA-B400 Not Qualified 85 °C -40 °C AEC-Q100 400 PLASTIC/EPOXY LFBGA BGA400,20X20,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.6 mm 17 mm 17 mm NXP SEMICONDUCTORS unknown 8542.31.00.01 LFBGA,
MCIMX355AJQ5CR2
 Freescale Semiconductor 		Check for Price Yes Yes Transferred SoC 3 260 40 TIN SILVER COPPER OVER NICKEL FREESCALE SEMICONDUCTOR INC compliant 5A002.A 8542.31.00.01 NXP
MCIMX355AJQ5C
 Freescale Semiconductor 		Check for Price Yes Yes Transferred YES SoC INDUSTRIAL S-PBGA-B400 Not Qualified 3 260 40 400 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER OVER NICKEL BALL 800 µm BOTTOM 1.6 mm 17 mm 17 mm FREESCALE SEMICONDUCTOR INC compliant 5A002.A 8542.31.00.01 NXP 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400 BGA 400
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