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Parametric results for: mcimx53xd under Microprocessors

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Manufacturer Part Number: mcimx53
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MCIMX537CVV8C
 Freescale Semiconductor 		$18.3000 Yes Yes Transferred 32 800 MHz 32 26 27 MHz YES 1.1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.15 V 1.05 V S-PBGA-B529 Not Qualified e2 3 260 40 529 PLASTIC/EPOXY FBGA BGA529,23X23,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER BALL 800 µm BOTTOM 1.85 mm 19 mm 19 mm FREESCALE SEMICONDUCTOR INC BGA 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529 529 compliant 5A002.A 8542.31.00.01 NXP
MCIMX535DVV1C
 Freescale Semiconductor 		$26.3250 Yes Yes Transferred YES 1.25 V SoC CMOS 1.4 V 1.2 V OTHER S-PBGA-B529 Not Qualified e2 3 85 °C -20 °C 260 40 529 PLASTIC/EPOXY FBGA BGA529,23X23,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER BALL 800 µm BOTTOM 1.85 mm 19 mm 19 mm FREESCALE SEMICONDUCTOR INC BGA TEPBGA-529 529 compliant 5A002.A 8542.31.00.01 NXP
MCIMX535DVV1CR2
 NXP Semiconductors 		$27.3980 Yes Obsolete YES 1.25 V SoC CMOS 1.4 V 1.2 V S-PBGA-B529 Not Qualified e2 3 85 °C -20 °C 260 40 529 PLASTIC/EPOXY HBGA BGA529,23X23,32 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.85 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEBGA-529 compliant 5A992.C 8542.31.00.01 NXP
MCIMX534AVV8CR2
 NXP Semiconductors 		$28.4088 Yes Obsolete YES 1.1 V SoC CMOS 1.15 V 1.05 V AUTOMOTIVE S-PBGA-B529 e2 3 125 °C -40 °C 260 AEC-Q100 40 529 PLASTIC/EPOXY FBGA BGA529,23X23,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.85 mm 19 mm 19 mm NXP SEMICONDUCTORS HBGA, compliant 5A992.C 8542.31.00.01 NXP
MCIMX535DVV2C
 NXP Semiconductors 		$28.8960 Yes Obsolete YES 1.35 V CMOS 1.4 V 1.3 V S-PBGA-B529 e2 3 260 40 529 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.85 mm 19 mm 19 mm NXP SEMICONDUCTORS TEBGA-2-529 compliant 5A992.C 8542.31.00.01 NXP
MCIMX535DVV1C
 NXP Semiconductors 		$29.8576 Yes Obsolete YES 1.25 V SoC CMOS 1.4 V 1.2 V OTHER S-PBGA-B529 Not Qualified e2 3 85 °C -20 °C 260 40 529 PLASTIC/EPOXY FBGA BGA529,23X23,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.85 mm 19 mm 19 mm NXP SEMICONDUCTORS TEPBGA-529 compliant 5A992.C 8542.31.00.01 NXP
MCIMX534AVV8C
 NXP Semiconductors 		$30.5256 Yes Obsolete YES 1.1 V SoC CMOS 1.15 V 1.05 V AUTOMOTIVE S-PBGA-B529 Not Qualified e2 3 125 °C -40 °C 260 AEC-Q100 40 529 PLASTIC/EPOXY FBGA BGA529,23X23,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.85 mm 19 mm 19 mm NXP SEMICONDUCTORS BGA-529 compliant 5A992.C 8542.31.00.01 NXP
MCIMX537CVV8CR2
 NXP Semiconductors 		$30.6831 Yes Obsolete 32 800 MHz 32 16 27 MHz YES 1.1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.15 V 1.05 V AUTOMOTIVE S-PBGA-B529 Not Qualified e2 3 125 °C -40 °C 260 40 529 PLASTIC/EPOXY FBGA BGA529,23X23,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.9 mm 19 mm 19 mm NXP SEMICONDUCTORS FBGA, BGA529,23X23,32 compliant 5A992.C 8542.31.00.01 NXP
MCIMX537CVV8C
 NXP Semiconductors 		$33.4209 Yes Obsolete 32 800 MHz 73728 CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB 32 26 27 MHz 19 YES 950 mV MICROPROCESSOR, RISC CMOS 1.1V NOMIVAL AVAILABLE WITH 800MHZ YES FLOATING POINT YES YES 2 1.45 A 1.15 V 900 mV AUTOMOTIVE S-PBGA-B529 Not Qualified e2 3 125 °C -40 °C 260 40 529 PLASTIC/EPOXY FBGA BGA529,23X23,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.85 mm 19 mm 19 mm NXP SEMICONDUCTORS TEBGA-529 compliant 5A992.C 8542.31.00.01 NXP
MCIMX536AVV8C
 NXP Semiconductors 		$38.8783 Yes Obsolete YES 1.1 V SoC CMOS 1.15 V 1.05 V AUTOMOTIVE S-PBGA-B529 Not Qualified e2 3 125 °C -40 °C 260 AEC-Q100 40 529 PLASTIC/EPOXY FBGA BGA529,23X23,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.85 mm 19 mm 19 mm NXP SEMICONDUCTORS TEBGA-529 compliant 5A992.C 8542.31.00.01 NXP
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