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MCZ33999EK
NXP Semiconductors
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$7.0851 | Yes | Active | 13 V | 16 | 1.2 A | 10 µs | 10 µs | SIPO BASED PERIPHERAL DRIVER | BCDMOS | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | 1 | SINK | 27 V | 5 V | YES | AUTOMOTIVE | R-PDSO-G54 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 54 | PLASTIC/EPOXY | HSSOP | SSOP54,.4 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 17.9 mm | 2.45 mm | 7.5 mm | NXP SEMICONDUCTORS | 0.65 MM PITCH, ROHS COMPLIANT, SOIC-54 | compliant | EAR99 | 8542.39.00.01 | NXP | |||||
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MCZ33999EKR2
NXP Semiconductors
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Check for Price | Yes | Active | 13 V | 16 | 1.2 A | 10 µs | 10 µs | SIPO BASED PERIPHERAL DRIVER | BCDMOS | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | 1 | SINK | 27 V | 5 V | YES | AUTOMOTIVE | R-PDSO-G54 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 54 | PLASTIC/EPOXY | HSSOP | SSOP54,.4 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 17.9 mm | 2.45 mm | 7.5 mm | NXP SEMICONDUCTORS | 0.65 MM PITCH, ROHS COMPLIANT, SOIC-54 | compliant | EAR99 | 8542.39.00.01 | NXP | |||||
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MCZ33999EK
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 13 V | 1.2 A | 10 µs | 10 µs | SIPO BASED PERIPHERAL DRIVER | BCDMOS | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | 1 | SINK | 27 V | 5 V | YES | AUTOMOTIVE | R-PDSO-G54 | COMMERCIAL | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 54 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 17.9 mm | 2.45 mm | 7.5 mm | ROCHESTER ELECTRONICS LLC | 0.65 MM PITCH, LEAD FREE, SOIC-54 | unknown | SOIC | 54 | |||||||
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MCZ33999EKR2
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 13 V | 1.2 A | 10 µs | 10 µs | SIPO BASED PERIPHERAL DRIVER | BCDMOS | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | 1 | SINK | 27 V | 5 V | YES | AUTOMOTIVE | R-PDSO-G54 | COMMERCIAL | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 54 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 17.9 mm | 2.45 mm | 7.5 mm | ROCHESTER ELECTRONICS LLC | 0.65 MM PITCH, LEAD FREE, SOIC-54 | unknown | SOIC | 54 | |||||||
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MCZ33999EKR2
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | 13 V | 16 | 1.2 A | 10 µs | 10 µs | SIPO BASED PERIPHERAL DRIVER | BCDMOS | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | 1 | SINK | 27 V | 5 V | YES | AUTOMOTIVE | R-PDSO-G54 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 54 | PLASTIC/EPOXY | HSSOP | SSOP54,.4 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 17.9 mm | 2.45 mm | 7.5 mm | FREESCALE SEMICONDUCTOR INC | 0.65 MM PITCH, ROHS COMPLIANT, SOIC-54 | compliant | EAR99 | 8542.31.00.01 | NXP | SOIC | 54 | ||
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MCZ33999EK
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | 13 V | 16 | 1.2 A | 10 µs | 10 µs | SIPO BASED PERIPHERAL DRIVER | BCDMOS | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | 1 | SINK | 27 V | 5 V | YES | AUTOMOTIVE | R-PDSO-G54 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 54 | PLASTIC/EPOXY | HSSOP | SSOP54,.4 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 17.9 mm | 2.45 mm | 7.5 mm | FREESCALE SEMICONDUCTOR INC | 0.65 MM PITCH, ROHS COMPLIANT, SOIC-54 | compliant | EAR99 | 8542.31.00.01 | NXP | SOIC | 54 |