Findchips: Parametric Search Results for mk22fn256cap12r


Select Parts		Part Number

		MK22FN256CAP12R Freescale Semiconductor
		MK22FN256CAP12R NXP Semiconductors

				Most Relevant									Technical												Compliance			Operating Conditions					Physical										Dimensions		Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	ROM (words)	RAM (bytes)	CPU Family	Clock Frequency-Max	Number of I/O Lines	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	DAC Channels	DMA Channels	Has ADC	On Chip Program ROM Width	PWM Channels	ROM Programmability	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	Samacsys Manufacturer	ECCN Code	HTS Code

Check for Price

Yes

Transferred

120 MHz

262144

50 MHz

YES

3.3 V

MICROCONTROLLER, RISC

CMOS

YES

FLASH

3.6 V

1.71 V

INDUSTRIAL

R-PBGA-B80

85 °C

-40 °C

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

TIN SILVER COPPER

BALL

400 µm

BOTTOM

3.56 mm

4.13 mm

FREESCALE SEMICONDUCTOR INC

4.13 X 3.56 MM, 0.564 MM HEIGHT, 0.40 MM PITCH, WLCSP-80

compliant

NXP

Check for Price

Yes

Active

120 MHz

262144

131072

CORTEX-M4F

50 MHz

YES

3.3 V

MICROCONTROLLER, RISC

CMOS

YES

FLASH

36.93 mA

3.6 V

3.3 V

INDUSTRIAL

R-PBGA-B80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

BGA

BGA80,8X10,16

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

400 µm

BOTTOM

3.56 mm

4.13 mm

NXP SEMICONDUCTORS

4.13 X 3.56 MM, 0.564 MM HEIGHT, 0.40 MM PITCH, WLCSP-80

compliant

NXP

3A991.A.2

8542.31.00.01

Compare

MK22FN256CAP12R

Freescale Semiconductor

Check for Price

Yes

Transferred

120 MHz

262144

50 MHz

YES

3.3 V

MICROCONTROLLER, RISC

CMOS

YES

FLASH

3.6 V

1.71 V

INDUSTRIAL

R-PBGA-B80

85 °C

-40 °C

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

TIN SILVER COPPER

BALL

400 µm

BOTTOM

3.56 mm

4.13 mm

FREESCALE SEMICONDUCTOR INC

4.13 X 3.56 MM, 0.564 MM HEIGHT, 0.40 MM PITCH, WLCSP-80

compliant

NXP

MK22FN256CAP12R

NXP Semiconductors

Check for Price

Yes

Active

120 MHz

262144

131072

CORTEX-M4F

50 MHz

YES

3.3 V

MICROCONTROLLER, RISC

CMOS

YES

FLASH

36.93 mA

3.6 V

3.3 V

INDUSTRIAL

R-PBGA-B80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

BGA

BGA80,8X10,16

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

400 µm

BOTTOM

3.56 mm

4.13 mm

NXP SEMICONDUCTORS

4.13 X 3.56 MM, 0.564 MM HEIGHT, 0.40 MM PITCH, WLCSP-80

compliant

NXP

3A991.A.2

8542.31.00.01

Parametric results for: mk22fn256cap12r under Microcontrollers