Findchips: Parametric Search Results for mpc5200cvr400


Select Parts		Part Number

		MPC5200CVR400B Freescale Semiconductor
		MPC5200CVR400 NXP Semiconductors
		MPC5200CVR400BR2 NXP Semiconductors
		MPC5200CVR400B NXP Semiconductors
		MPC5200CVR400B Rochester Electronics LLC
		MPC5200CVR400 Freescale Semiconductor
		MPC5200CVR400BR2 Freescale Semiconductor

				Most Relevant							Technical										Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$36.2231

Yes

Transferred

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

Not Qualified

85 °C

-40 °C

260

272

PLASTIC/EPOXY

BGA

BGA272,20X20,50

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

FREESCALE SEMICONDUCTOR INC

BGA

27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272

272

compliant

3A991.A.2

8542.31.00.01

NXP

$43.6149

Yes

Not Recommended

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

YES

FIXED POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

85 °C

-40 °C

260

272

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

NXP SEMICONDUCTORS

27 X 27 MM, 1.27 MM PITCH, PLASTIC, TEBGA-272

compliant

3A991.A.2

8542.31.00.01

NXP

$54.4172

Yes

Not Recommended

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

Not Qualified

85 °C

-40 °C

260

272

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

NXP SEMICONDUCTORS

27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272

compliant

3A991.A.2

8542.31.00.01

NXP

$58.1862

Yes

Not Recommended

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

85 °C

-40 °C

260

272

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

NXP SEMICONDUCTORS

TEBGA-272

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Active

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

COMMERCIAL

85 °C

-40 °C

260

NOT SPECIFIED

272

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN SILVER

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

ROCHESTER ELECTRONICS INC

BGA

BGA,

272

unknown

Check for Price

Yes

Transferred

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

YES

FIXED POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

85 °C

-40 °C

260

272

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

FREESCALE SEMICONDUCTOR INC

27 X 27 MM, 1.27 MM PITCH, PLASTIC, TEBGA-272

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Transferred

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

Not Qualified

85 °C

-40 °C

260

272

PLASTIC/EPOXY

BGA

BGA272,20X20,50

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

FREESCALE SEMICONDUCTOR INC

BGA

27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272

272

compliant

3A991.A.2

8542.31.00.01

NXP

Compare

MPC5200CVR400B

Freescale Semiconductor

$36.2231

Yes

Transferred

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

Not Qualified

85 °C

-40 °C

260

272

PLASTIC/EPOXY

BGA

BGA272,20X20,50

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

FREESCALE SEMICONDUCTOR INC

BGA

27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272

272

compliant

3A991.A.2

8542.31.00.01

NXP

MPC5200CVR400

NXP Semiconductors

$43.6149

Yes

Not Recommended

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

YES

FIXED POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

85 °C

-40 °C

260

272

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

NXP SEMICONDUCTORS

27 X 27 MM, 1.27 MM PITCH, PLASTIC, TEBGA-272

compliant

3A991.A.2

8542.31.00.01

NXP

MPC5200CVR400BR2

NXP Semiconductors

$54.4172

Yes

Not Recommended

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

Not Qualified

85 °C

-40 °C

260

272

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

NXP SEMICONDUCTORS

27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272

compliant

3A991.A.2

8542.31.00.01

NXP

MPC5200CVR400B

NXP Semiconductors

$58.1862

Yes

Not Recommended

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

85 °C

-40 °C

260

272

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

NXP SEMICONDUCTORS

TEBGA-272

compliant

3A991.A.2

8542.31.00.01

NXP

MPC5200CVR400B

Rochester Electronics LLC

Check for Price

Yes

Active

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

COMMERCIAL

85 °C

-40 °C

260

NOT SPECIFIED

272

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN SILVER

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

ROCHESTER ELECTRONICS INC

BGA

BGA,

272

unknown

MPC5200CVR400

Freescale Semiconductor

Check for Price

Yes

Transferred

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

YES

FIXED POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

85 °C

-40 °C

260

272

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

FREESCALE SEMICONDUCTOR INC

27 X 27 MM, 1.27 MM PITCH, PLASTIC, TEBGA-272

compliant

3A991.A.2

8542.31.00.01

NXP

MPC5200CVR400BR2

Freescale Semiconductor

Check for Price

Yes

Transferred

400 MHz

35 MHz

YES

1.5 V

MICROPROCESSOR

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

1.58 V

1.42 V

INDUSTRIAL

S-PBGA-B272

Not Qualified

85 °C

-40 °C

260

272

PLASTIC/EPOXY

BGA

BGA272,20X20,50

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.65 mm

27 mm

FREESCALE SEMICONDUCTOR INC

BGA

27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272

272

compliant

3A991.A.2

8542.31.00.01

NXP

Parametric results for: mpc5200cvr400 under Microprocessors