Findchips: Parametric Search Results for mpc603afe66ac


Select Parts		Part Number

		MPC603AFE66AC Motorola Mobility LLC
		MPC603AFE66AC Motorola Semiconductor Products
		MPC603AFE66AC NXP Semiconductors
		MPC603AFE66AC Freescale Semiconductor

			Most Relevant							Technical								Compliance			Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

66.67 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

3.465 V

3.135 V

S-CQFP-G240

Not Qualified

240

CERAMIC, METAL-SEALED COFIRED

QFP

QFP240,1.3SQ,20

SQUARE

FLATPACK

TIN LEAD

GULL WING

550 µm

QUAD

2.93 mm

32 mm

MOTOROLA INC

QFP

QFP, QFP240,1.3SQ,20

240

unknown

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

66.67 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

3.465 V

3.135 V

S-CQFP-G240

Not Qualified

240

CERAMIC, METAL-SEALED COFIRED

QFP

QFP240,1.3SQ,20

SQUARE

FLATPACK

TIN LEAD

GULL WING

550 µm

QUAD

2.93 mm

32 mm

MOTOROLA INC

32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240

unknown

3A991.A.2

8542.31.00.01

Check for Price

Active

66.67 MHz

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

3.465 V

3.135 V

S-CQFP-G240

Not Qualified

240

CERAMIC, METAL-SEALED COFIRED

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

GULL WING

500 µm

QUAD

4.15 mm

32 mm

NXP SEMICONDUCTORS

FQFP, QFP240,1.3SQ,20

compliant

3A991.A.2

8542.31.00.01

Check for Price

Transferred

66.67 MHz

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

3.465 V

3.135 V

S-CQFP-G240

Not Qualified

240

CERAMIC, METAL-SEALED COFIRED

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

GULL WING

500 µm

QUAD

4.15 mm

32 mm

FREESCALE SEMICONDUCTOR INC

QFP

32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240

240

unknown

3A991.A.2

8542.31.00.01

Compare

MPC603AFE66AC

Motorola Mobility LLC

Check for Price

Obsolete

66.67 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

3.465 V

3.135 V

S-CQFP-G240

Not Qualified

240

CERAMIC, METAL-SEALED COFIRED

QFP

QFP240,1.3SQ,20

SQUARE

FLATPACK

TIN LEAD

GULL WING

550 µm

QUAD

2.93 mm

32 mm

MOTOROLA INC

QFP

QFP, QFP240,1.3SQ,20

240

unknown

3A991.A.2

8542.31.00.01

MPC603AFE66AC

Motorola Semiconductor Products

Check for Price

Obsolete

66.67 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

3.465 V

3.135 V

S-CQFP-G240

Not Qualified

240

CERAMIC, METAL-SEALED COFIRED

QFP

QFP240,1.3SQ,20

SQUARE

FLATPACK

TIN LEAD

GULL WING

550 µm

QUAD

2.93 mm

32 mm

MOTOROLA INC

32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240

unknown

3A991.A.2

8542.31.00.01

MPC603AFE66AC

NXP Semiconductors

Check for Price

Active

66.67 MHz

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

3.465 V

3.135 V

S-CQFP-G240

Not Qualified

240

CERAMIC, METAL-SEALED COFIRED

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

GULL WING

500 µm

QUAD

4.15 mm

32 mm

NXP SEMICONDUCTORS

FQFP, QFP240,1.3SQ,20

compliant

3A991.A.2

8542.31.00.01

MPC603AFE66AC

Freescale Semiconductor

Check for Price

Transferred

66.67 MHz

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

3.465 V

3.135 V

S-CQFP-G240

Not Qualified

240

CERAMIC, METAL-SEALED COFIRED

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

GULL WING

500 µm

QUAD

4.15 mm

32 mm

FREESCALE SEMICONDUCTOR INC

QFP

32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240

240

unknown

3A991.A.2

8542.31.00.01

Parametric results for: mpc603afe66ac under Microprocessors