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Manufacturer Part Number: mpc8313e
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MPC8313EVRAFFC
 NXP Semiconductors 		$28.5525 Yes Not Recommended 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516 compliant 5A002.A.1 8542.31.00.01 NXP
MPC8313EVRAGDC
 NXP Semiconductors 		$30.4529 Yes Not Recommended 32 400 MHz 32 15 YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGAII-516 compliant 5A002.A.1 8542.31.00.01 NXP
MPC8313EVRADDC
 NXP Semiconductors 		$37.4878 Yes Not Recommended 32 266 MHz 32 15 YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGAII-516 compliant 5A002.A.1 8542.31.00.01 NXP
MPC8313ECVRADDC
 NXP Semiconductors 		$43.1150 Yes Not Recommended 32 266 MHz 32 15 YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B516 Not Qualified e2 3 105 °C -40 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGAII-516 compliant 5A002.A.1 8542.31.00.01
MPC8313ECVRAFFC
 NXP Semiconductors 		$48.1574 Yes Not Recommended 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B516 Not Qualified e4 3 105 °C -40 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Nickel/Gold (Ni/Au) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516 compliant 5A002.A.1 8542.31.00.01 NXP
MPC8313VRADDB
 Freescale Semiconductor 		Check for Price Yes Yes Obsolete 32 400 MHz YES MICROPROCESSOR, RISC CMOS OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY BGA BGA516,26X26,40 SQUARE GRID ARRAY TIN SILVER BALL 1 mm BOTTOM FREESCALE SEMICONDUCTOR INC unknown
MPC8313EZQAFF
 Freescale Semiconductor 		Check for Price No Obsolete 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.5 V 950 mV S-PBGA-B516 Not Qualified e0 3 260 40 516 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516 not_compliant 5A002 8542.31.00.01 BGA 516
MPC8313ECZQAGF
 NXP Semiconductors 		Check for Price Active NXP SEMICONDUCTORS compliant 8542.31.00.01
MPC8313EVRAGD
 NXP Semiconductors 		Check for Price Active 32 400 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.5 V 950 mV S-PBGA-B516 Not Qualified e1 516 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 3A991.A.2 8542.31.00.01
MPC8313ECVRAFFB
 Rochester Electronics LLC 		Check for Price No Yes Active 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.5 V 950 mV S-PBGA-B516 COMMERCIAL e2 3 260 40 516 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN COPPER/TIN SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm ROCHESTER ELECTRONICS LLC 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516 unknown BGA 516
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