Findchips: Parametric Search Results for mpc8360ezuajdga


Select Parts		Part Number

		MPC8360EZUAJDGA NXP Semiconductors
		MPC8360EZUAJDGA Freescale Semiconductor

				Most Relevant							Technical								Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

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Obsolete

533 MHz

66.67 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.35 V

1.15 V

S-PBGA-B740

Not Qualified

70 °C

260

740

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.69 mm

37.5 mm

NXP SEMICONDUCTORS

37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740

unknown

5A002.A.1

8542.31.00.01

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Transferred

533 MHz

66.67 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.35 V

1.15 V

S-PBGA-B740

Not Qualified

260

740

PLASTIC/EPOXY

LBGA

BGA740,37X37,40

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Lead/Silver (Sn/Pb/Ag)

BALL

1 mm

BOTTOM

1.69 mm

37.5 mm

FREESCALE SEMICONDUCTOR INC

37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740

not_compliant

5A002

8542.31.00.01

BGA

740

Compare

MPC8360EZUAJDGA

NXP Semiconductors

Check for Price

Obsolete

533 MHz

66.67 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.35 V

1.15 V

S-PBGA-B740

Not Qualified

70 °C

260

740

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.69 mm

37.5 mm

NXP SEMICONDUCTORS

37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740

unknown

5A002.A.1

8542.31.00.01

MPC8360EZUAJDGA

Freescale Semiconductor

Check for Price

Transferred

533 MHz

66.67 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.35 V

1.15 V

S-PBGA-B740

Not Qualified

260

740

PLASTIC/EPOXY

LBGA

BGA740,37X37,40

SQUARE

GRID ARRAY, LOW PROFILE

Tin/Lead/Silver (Sn/Pb/Ag)

BALL

1 mm

BOTTOM

1.69 mm

37.5 mm

FREESCALE SEMICONDUCTOR INC

37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740

not_compliant

5A002

8542.31.00.01

BGA

740

Parametric results for: mpc8360ezuajdga under Microprocessors