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MPC850DEZQ50BU
NXP Semiconductors
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$37.4663 | No | Obsolete | 32 | 50 MHz | 32 | 26 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.6 V | 3 V | OTHER | S-PBGA-B256 | Not Qualified | e0 | 3 | 95 °C | 260 | 40 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,50 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 2.54 mm | 23 mm | 23 mm | NXP SEMICONDUCTORS | BGA-256 | unknown | 3A991.A.2 | 8542.31.00.01 | |||||||||
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MPC850DEVR50BU
NXP Semiconductors
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$40.6483 | Yes | Obsolete | 32 | 50 MHz | 32 | 26 | 50 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 260 | 40 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,50 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.35 mm | 23 mm | 23 mm | NXP SEMICONDUCTORS | 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||
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MPC850DEVR80BU
NXP Semiconductors
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Check for Price | Yes | Obsolete | 32 | 80 MHz | 32 | 26 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.6 V | 3 V | OTHER | S-PBGA-B256 | Not Qualified | e1 | 3 | 95 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,50 | SQUARE | GRID ARRAY | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.54 mm | 23 mm | 23 mm | NXP SEMICONDUCTORS | BGA, BGA256,16X16,50 | compliant | 5A991 | 8542.31.00.01 | |||||||||||
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MPC850DSL
NXP Semiconductors
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Check for Price | Obsolete | NXP SEMICONDUCTORS | compliant | 8542.31.00.01 | |||||||||||||||||||||||||||||||||||||||||||||||
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MPC850SRZT33A
Motorola Semiconductor Products
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Check for Price | Obsolete | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | SUPPORTS MULTICHANNEL HDLC AND ATM | COMMERCIAL | R-PBGA-B256 | Not Qualified | 70 °C | 256 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | BALL | BOTTOM | MOTOROLA INC | BGA, | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||||||
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MPC850DSLZQ50BU
Freescale Semiconductor
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Check for Price | No | No | Transferred | 32 | 50 MHz | 32 | 26 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.6 V | 3 V | OTHER | S-PBGA-B256 | e0 | 3 | 95 °C | 260 | 40 | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 2.54 mm | 23 mm | 23 mm | FREESCALE SEMICONDUCTOR INC | BGA, | not_compliant | 3A991.A.2 | 8542.31.00.01 | ||||||||||
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MPC850SRZQ66BU
Freescale Semiconductor
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Check for Price | No | No | Obsolete | 32 | 66 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | S-PBGA-B256 | Not Qualified | e0 | 3 | 260 | 40 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,50 | SQUARE | GRID ARRAY | TIN LEAD SILVER | BALL | 1.27 mm | BOTTOM | FREESCALE SEMICONDUCTOR INC | not_compliant | ||||||||||||||||||||||||
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MPC850VR80BU
Freescale Semiconductor
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Check for Price | Yes | Yes | Obsolete | 32 | 80 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | S-PBGA-B256 | Not Qualified | e1 | 3 | 260 | 40 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,50 | SQUARE | GRID ARRAY | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | FREESCALE SEMICONDUCTOR INC | unknown | ||||||||||||||||||||||||
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MPC850ZT50
Motorola Mobility LLC
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Check for Price | Obsolete | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | SUPPORTS MULTIPLE PROTOCOLS | COMMERCIAL | R-PBGA-B256 | Not Qualified | 70 °C | 256 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | BALL | BOTTOM | MOTOROLA INC | BGA, | unknown | 8542.31.00.01 | BGA | 256 | ||||||||||||||||||||||||||||
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MPC850CVR66BU
NXP Semiconductors
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Check for Price | Yes | Obsolete | 32 | 66 MHz | 32 | 26 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.6 V | 3 V | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 95 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,50 | SQUARE | GRID ARRAY | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.54 mm | 23 mm | 23 mm | NXP SEMICONDUCTORS | BGA, BGA256,16X16,50 | compliant | 5A991 | 8542.31.00.01 |