Findchips: Parametric Search Results for mpc8541vtapf


Select Parts		Part Number

		MPC8541VTAPF NXP Semiconductors
		MPC8541VTAPF Rochester Electronics LLC
		MPC8541VTAPFX NXP Semiconductors
		MPC8541VTAPFX Freescale Semiconductor
		MPC8541VTAPF Freescale Semiconductor

				Most Relevant							Technical										Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

$145.5822

Yes

Obsolete

833 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

OTHER

R-PBGA-B783

Not Qualified

105 °C

260

783

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

3.75 mm

29 mm

NXP SEMICONDUCTORS

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783

not_compliant

5A992

8542.31.00.01

Check for Price

Yes

Active

833 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

OTHER

R-PBGA-B783

COMMERCIAL

105 °C

260

783

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

TIN COPPER/TIN SILVER

BALL

1 mm

BOTTOM

3.75 mm

29 mm

ROCHESTER ELECTRONICS LLC

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783

unknown

BGA

783

Check for Price

Obsolete

1 GHz

200 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

LOW POWER TAKEN FROM SLEEP MODE

YES

FLOATING POINT

YES

1.2 V

1.1 V

COMMERCIAL

S-CBGA-X360

Not Qualified

70 °C

360

CERAMIC, METAL-SEALED COFIRED

CGA

SQUARE

GRID ARRAY

UNSPECIFIED

1.27 mm

BOTTOM

1.8 mm

25 mm

NXP SEMICONDUCTORS

CGA,

unknown

3A991.A.2

8542.31.00.01

Check for Price

Transferred

1 GHz

200 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

LOW POWER TAKEN FROM SLEEP MODE

YES

FLOATING POINT

YES

1.2 V

1.1 V

COMMERCIAL

S-CBGA-X360

Not Qualified

70 °C

360

CERAMIC, METAL-SEALED COFIRED

CGA

SQUARE

GRID ARRAY

UNSPECIFIED

1.27 mm

BOTTOM

1.8 mm

25 mm

FREESCALE SEMICONDUCTOR INC

CGA,

unknown

3A991.A.2

8542.31.00.01

LGA

360

Check for Price

Yes

Transferred

833 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

OTHER

R-PBGA-B783

Not Qualified

105 °C

260

783

PLASTIC/EPOXY

HBGA

BGA783,28X28,40

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

BALL

1 mm

BOTTOM

3.75 mm

29 mm

FREESCALE SEMICONDUCTOR INC

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783

not_compliant

5A992

8542.31.00.01

BGA

783

Compare

MPC8541VTAPF

NXP Semiconductors

$145.5822

Yes

Obsolete

833 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

OTHER

R-PBGA-B783

Not Qualified

105 °C

260

783

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

3.75 mm

29 mm

NXP SEMICONDUCTORS

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783

not_compliant

5A992

8542.31.00.01

MPC8541VTAPF

Rochester Electronics LLC

Check for Price

Yes

Active

833 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

OTHER

R-PBGA-B783

COMMERCIAL

105 °C

260

783

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

TIN COPPER/TIN SILVER

BALL

1 mm

BOTTOM

3.75 mm

29 mm

ROCHESTER ELECTRONICS LLC

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783

unknown

BGA

783

MPC8541VTAPFX

NXP Semiconductors

Check for Price

Obsolete

1 GHz

200 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

LOW POWER TAKEN FROM SLEEP MODE

YES

FLOATING POINT

YES

1.2 V

1.1 V

COMMERCIAL

S-CBGA-X360

Not Qualified

70 °C

360

CERAMIC, METAL-SEALED COFIRED

CGA

SQUARE

GRID ARRAY

UNSPECIFIED

1.27 mm

BOTTOM

1.8 mm

25 mm

NXP SEMICONDUCTORS

CGA,

unknown

3A991.A.2

8542.31.00.01

MPC8541VTAPFX

Freescale Semiconductor

Check for Price

Transferred

1 GHz

200 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

LOW POWER TAKEN FROM SLEEP MODE

YES

FLOATING POINT

YES

1.2 V

1.1 V

COMMERCIAL

S-CBGA-X360

Not Qualified

70 °C

360

CERAMIC, METAL-SEALED COFIRED

CGA

SQUARE

GRID ARRAY

UNSPECIFIED

1.27 mm

BOTTOM

1.8 mm

25 mm

FREESCALE SEMICONDUCTOR INC

CGA,

unknown

3A991.A.2

8542.31.00.01

LGA

360

MPC8541VTAPF

Freescale Semiconductor

Check for Price

Yes

Transferred

833 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

OTHER

R-PBGA-B783

Not Qualified

105 °C

260

783

PLASTIC/EPOXY

HBGA

BGA783,28X28,40

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

BALL

1 mm

BOTTOM

3.75 mm

29 mm

FREESCALE SEMICONDUCTOR INC

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783

not_compliant

5A992

8542.31.00.01

BGA

783

Parametric results for: mpc8541vtapf under Microprocessors