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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: mpc857dslvr50b under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		MPC857DSLVR50B Freescale Semiconductor
		MPC857DSLVR50B NXP Semiconductors

			Most Relevant						Technical									Compliance		Operating Conditions				Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

32

50 MHz

32

32

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

OTHER

S-PBGA-B357

e1

3

105 °C

245

30

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA-357

compliant

Check for Price

Yes

Obsolete

32

50 MHz

32

32

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

OTHER

S-PBGA-B357

e1

3

105 °C

245

30

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

NXP SEMICONDUCTORS

BGA-357

compliant

5A991

8542.31.00.01

Compare

Freescale Semiconductor

Check for Price

Yes

Transferred

32

50 MHz

32

32

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

OTHER

S-PBGA-B357

e1

3

105 °C

245

30

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA-357

compliant

NXP Semiconductors

Check for Price

Yes

Obsolete

32

50 MHz

32

32

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

OTHER

S-PBGA-B357

e1

3

105 °C

245

30

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

NXP SEMICONDUCTORS

BGA-357

compliant

5A991

8542.31.00.01