Parametric results for: mpc860pzq66d4 under Microprocessors

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Manufacturer Part Number: mpc860pzq66d4
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MPC860PZQ66D4
NXP Semiconductors
$99.3421 No Obsolete 32 66 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 Not Qualified e0 3 245 30 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm NXP SEMICONDUCTORS 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 unknown 3A991.A.2 8542.31.00.01 NXP
MPC860PZQ66D4R2
Freescale Semiconductor
Check for Price No Transferred 32 66 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 Not Qualified e0 3 245 30 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm FREESCALE SEMICONDUCTOR INC BGA, BGA357,19X19,50 not_compliant 5A991 8542.31.00.01 BGA 357
MPC860PZQ66D4R2
NXP Semiconductors
Check for Price Obsolete MICROPROCESSOR, RISC NXP SEMICONDUCTORS , unknown 8542.31.00.01
KMPC860PZQ66D4
Freescale Semiconductor
Check for Price No No Obsolete 32 66 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 Not Qualified e0 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm FREESCALE SEMICONDUCTOR INC BGA, BGA357,19X19,50 compliant 3A991.A.2 8542.31.00.01 BGA 357
MPC860PZQ66D4
Freescale Semiconductor
Check for Price No No Transferred 32 66 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 Not Qualified e0 3 245 30 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm FREESCALE SEMICONDUCTOR INC 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 not_compliant 3A991.A.2 8542.31.00.01 NXP BGA 357