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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: mpc866tcvr100a under Microprocessors

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Select Parts		Part Number

		MPC866TCVR100A NXP Semiconductors
		MPC866TCVR100A Freescale Semiconductor

				Most Relevant						Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

Yes

Obsolete

32

100 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

INDUSTRIAL

S-PBGA-B357

Not Qualified

e1

3

100 °C

-40 °C

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

NXP SEMICONDUCTORS

LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Yes

Transferred

32

100 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

INDUSTRIAL

S-PBGA-B357

Not Qualified

e1

3

100 °C

-40 °C

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

BGA

357

Compare

NXP Semiconductors

Yes

Obsolete

32

100 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

INDUSTRIAL

S-PBGA-B357

Not Qualified

e1

3

100 °C

-40 °C

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

NXP SEMICONDUCTORS

LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

Yes

Yes

Transferred

32

100 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

INDUSTRIAL

S-PBGA-B357

Not Qualified

e1

3

100 °C

-40 °C

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

BGA

357