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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: mpc870cvr133 under Microprocessors

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Select Parts		Part Number

		MPC870CVR133 NXP Semiconductors
		MPC870CVR133 Freescale Semiconductor
		KMPC870CVR133 Freescale Semiconductor

				Most Relevant						Technical								Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

Yes

Obsolete

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

NXP SEMICONDUCTORS

LEAD FREE, PLASTIC, BGA-256

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Yes

Transferred

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

LEAD FREE, PLASTIC, BGA-256

compliant

3A991.A.2

8542.31.00.01

NXP

BGA

256

Check for Price

Yes

Obsolete

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

LEAD FREE, PLASTIC, BGA-256

compliant

5A992

8542.31.00.01

BGA

256

Compare

NXP Semiconductors

Yes

Obsolete

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

NXP SEMICONDUCTORS

LEAD FREE, PLASTIC, BGA-256

compliant

3A991.A.2

8542.31.00.01

NXP

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

Yes

Yes

Transferred

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

LEAD FREE, PLASTIC, BGA-256

compliant

3A991.A.2

8542.31.00.01

NXP

BGA

256

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

Yes

Obsolete

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

LEAD FREE, PLASTIC, BGA-256

compliant

5A992

8542.31.00.01

BGA

256