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Parametric results for: mt8885 under Telecom Signaling Circuits

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Manufacturer Part Number: mt8885
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MT8885ANR
 Microsemi Corporation 		Check for Price No No Obsolete 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDSO-G24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 635 µm DUAL MICROSEMI CORP SSOP 24 unknown 8542.39.00.01
MT8885ANR1
 Microsemi Corporation 		Check for Price Yes Yes Obsolete 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDSO-G24 e3 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm MICROSEMI CORP SSOP 24 compliant 8542.39.00.01 5.30 MM, LEAD FREE, MO-150AG, SSOP-24
MT8885AP
 Zarlink Semiconductor Inc 		Check for Price No Obsolete 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL S-PQCC-J28 e0 Not Qualified 1 85 °C -40 °C 260 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm ZARLINK SEMICONDUCTOR INC compliant 8542.39.00.01 QCCJ, LDCC28,.5SQ
MT8885AE1
 Microsemi Corporation 		Check for Price Yes Yes Obsolete 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDIP-T24 e3 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 7.62 mm 30.99 mm 6.35 mm MICROSEMI CORP DIP 24 compliant 8542.39.00.01 LEAD FREE, PLASTIC, MS-011AA, DIP-24
MT8885AN
 Zarlink Semiconductor Inc 		Check for Price No Obsolete 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDSO-G24 e0 Not Qualified 3 85 °C -40 °C 260 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm ZARLINK SEMICONDUCTOR INC compliant 8542.39.00.01 SSOP, SSOP24,.3
MT8885AE
 Microsemi Corporation 		Check for Price No No Obsolete 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDIP-T24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY DIP DIP24,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL MICROSEMI CORP DIP 24 unknown 8542.39.00.01 Microsemi Corporation
MT8885ANR1
 Zarlink Semiconductor Inc 		Check for Price Yes Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 INDUSTRIAL R-PDSO-G24 e3 Not Qualified 3 85 °C -40 °C 260 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm ZARLINK SEMICONDUCTOR INC compliant 8542.39.00.01 5.30 MM, LEAD FREE, MO-150AG, SSOP-24
MT8885AP
 Microsemi Corporation 		Check for Price No No Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 11 mA INDUSTRIAL S-PQCC-J28 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES J BEND 1.27 mm QUAD MICROSEMI CORP unknown 8542.39.00.01
MT8885E
 Microsemi Corporation 		Check for Price No Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 11 mA INDUSTRIAL R-PDIP-T24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY DIP DIP24,.6 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL MICROSEMI CORP unknown 8542.39.00.01
MT8885AN1
 Microsemi Corporation 		Check for Price Yes Yes Obsolete 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDSO-G24 e3 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm MICROSEMI CORP SSOP 24 compliant 8542.39.00.01 5.30 MM, LEAD FREE, MO-150AG, SSOP-24 Microsemi Corporation
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