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Manufacturer Part Number: mtfc4gacaana4mit

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	Part Number

MTFC4GACAANA-4MIT

Micron Technology Inc

			Most Relevant	Technical																	Compliance	Operating Conditions				Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Technology	Clock Frequency-Max (fCLK)	Memory Density	Memory IC Type	Memory Width	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Organization	Output Characteristics	Parallel/Serial	Programming Voltage	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Nom (Vsup)	Temperature Grade	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Type

Check for Price

Yes

Obsolete

YES

CMOS

52 MHz

34.3597 Gbit

FLASH CARD

4000000000

4.295 G

SYNCHRONOUS

4GX8

OPEN-DRAIN

PARALLEL

3.3 V

3.6 V

2.7 V

3.3 V

INDUSTRIAL

R-PBGA-B100

85 °C

-40 °C

260

100

PLASTIC/EPOXY

TBGA

BGA100,10X17,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

14 mm

18 mm

MICRON TECHNOLOGY INC

compliant

EAR99

8542.32.00.51

MLC NAND TYPE

Compare

MTFC4GACAANA-4MIT

Micron Technology Inc

Check for Price

Yes

Obsolete

YES

CMOS

52 MHz

34.3597 Gbit

FLASH CARD

4000000000

4.295 G

SYNCHRONOUS

4GX8

OPEN-DRAIN

PARALLEL

3.3 V

3.6 V

2.7 V

3.3 V

INDUSTRIAL

R-PBGA-B100

85 °C

-40 °C

260

100

PLASTIC/EPOXY

TBGA

BGA100,10X17,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

14 mm

18 mm

MICRON TECHNOLOGY INC

compliant

EAR99

8542.32.00.51

MLC NAND TYPE