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PC107AMGH100LC
Teledyne e2v
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Check for Price | Obsolete | POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X | 64 | 32 | 66 MHz | YES | 2.5 V | CMOS | ALSO REQUIRES 3.3V SUPPLY | YES | 2.625 V | 2.375 V | MILITARY | S-CBGA-B503 | Not Qualified | 125 °C | -55 °C | 503 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 3.2 mm | 33 mm | 33 mm | E2V TECHNOLOGIES PLC | BGA | BGA, | 503 | unknown | 8542.39.00.01 | ||||||||
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PC107AVZFU100LC
Teledyne e2v
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Check for Price | Obsolete | POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X | 64 | 32 | 66 MHz | YES | 2.5 V | CMOS | ALSO REQUIRES 3.3V SUPPLY | YES | 2.625 V | 2.375 V | S-PBGA-B503 | Not Qualified | 503 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.75 mm | 33 mm | 33 mm | E2V TECHNOLOGIES PLC | BGA | BGA, | 503 | unknown | 8542.39.00.01 | |||||||||||
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PC107AMZFU100LB
Thomson-CSF Compsants Specific
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Check for Price | No | Transferred | YES | CMOS | S-PBGA-B503 | Not Qualified | e0 | 503 | PLASTIC/EPOXY | BGA | BGA503,25X25,50 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | THOMSON-CSF COMPSANTS SPECIFIC | BGA, BGA503,25X25,50 | unknown | 8542.31.00.01 | |||||||||||||||||||||
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MPC107APX66L0
Motorola Semiconductor Products
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Check for Price | Obsolete | PCI; I2C; 60X PROCESSOR | 64 | 32 | 66 MHz | 64 | NO | 2.5 V | CMOS | YES | 2.625 V | 2.375 V | OTHER | S-PPGA-P503 | Not Qualified | 105 °C | 503 | PLASTIC/EPOXY | PGA | SQUARE | GRID ARRAY | PIN/PEG | PERPENDICULAR | MOTOROLA INC | PGA, | unknown | 8542.39.00.01 | |||||||||||||||
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PC107AEGH100LC
Teledyne e2v
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Check for Price | Obsolete | TELEDYNE E2V (UK) LTD | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||||
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XPC107APX100LD
Motorola Mobility LLC
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Check for Price | No | Obsolete | PCI; I2C; 60X PROCESSOR | 64 | 32 | 66 MHz | 64 | YES | 2.5 V | CMOS | YES | 2.625 V | 2.375 V | S-PBGA-B503 | Not Qualified | 1 | 503 | PLASTIC/EPOXY | BGA | BGA503,25X25,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.75 mm | 33 mm | 33 mm | MOTOROLA INC | BGA | BGA, BGA503,25X25,50 | 503 | unknown | 8542.39.00.01 | ||||||||
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XPC107APX100LD
Motorola Semiconductor Products
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Check for Price | No | Obsolete | PCI; I2C; 60X PROCESSOR | 64 | 32 | 66 MHz | 64 | YES | 2.5 V | CMOS | YES | 2.625 V | 2.375 V | S-PBGA-B503 | Not Qualified | 1 | 503 | PLASTIC/EPOXY | BGA | BGA503,25X25,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.75 mm | 33 mm | 33 mm | MOTOROLA INC | 33 X 33 MM, PLASTIC, BGA-503 | unknown | 8542.39.00.01 | ||||||||||
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PC107AVZFU100LB
Teledyne e2v
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Check for Price | Obsolete | POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X | 64 | 32 | 66 MHz | YES | 2.5 V | CMOS | OPERATING JUNCTION TEMPERATURE -40 TO 110 | YES | 2.625 V | 2.375 V | INDUSTRIAL | S-PBGA-B503 | Not Qualified | 110 °C | -40 °C | 503 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1.27 mm | BOTTOM | 2.75 mm | 33 mm | 33 mm | TELEDYNE E2V (UK) LTD | BGA | HBGA, | 503 | unknown | 8542.39.00.01 | ||||||||
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XPC107APX100LA
Motorola Semiconductor Products
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Check for Price | Obsolete | PCI; I2C; 60X PROCESSOR | 64 | 32 | 100 MHz | 64 | YES | 2.5 V | CMOS | YES | 2.625 V | 2.375 V | S-PBGA-B503 | Not Qualified | 503 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.75 mm | 33 mm | 33 mm | MOTOROLA INC | BGA, | unknown | 8542.39.00.01 | |||||||||||||
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PC107AVGH100LD
Teledyne e2v
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Check for Price | Obsolete | POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X | 64 | 32 | 66 MHz | YES | 2.5 V | CMOS | ALSO REQUIRES 3.3V SUPPLY | YES | 2.625 V | 2.375 V | S-CBGA-B503 | Not Qualified | 503 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 3.2 mm | 33 mm | 33 mm | E2V TECHNOLOGIES PLC | BGA | BGA, | 503 | unknown | 8542.39.00.01 |