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Parametric results for: ppc750l, under Microprocessors

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Manufacturer Part Number: ppc750l
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IBM25PPC750L-GB350C2ST
 IBM 		Check for Price No No Contact Manufacturer 32 350 MHz 64 32 100 MHz YES 2.1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT 2.2 V 2 V S-XBGA-B360 Not Qualified 1 105 °C -40 °C 360 CERAMIC BGA BGA360,19X19,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 25 mm 25 mm IBM MICROELECTRONICS BGA 360 not_compliant 3A991.A.2 8542.31.00.01
IBM25PPC750L-GB533DD2ST
 IBM 		Check for Price No No Contact Manufacturer 32 533 MHz 64 32 100 MHz YES 2.1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT 2.2 V 2 V S-XBGA-B360 Not Qualified 1 105 °C -40 °C 360 CERAMIC BGA BGA360,19X19,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 25 mm 25 mm IBM MICROELECTRONICS BGA 360 not_compliant 3A991.A.2 8542.31.00.01
IBM25PPC750L-GB375D2ST
 IBM 		Check for Price No No Contact Manufacturer 32 375 MHz 64 32 100 MHz YES 2.1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT 2.2 V 2 V S-XBGA-B360 Not Qualified 1 105 °C -40 °C 360 CERAMIC BGA BGA360,19X19,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 25 mm 25 mm IBM MICROELECTRONICS BGA 360 not_compliant 3A991.A.2 8542.31.00.01
IBM25PPC750L-GB500CA2T
 IBM 		Check for Price No No Contact Manufacturer 32 500 MHz 64 32 100 MHz YES 2.1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT 2.2 V 2 V S-XBGA-B360 Not Qualified 1 105 °C -40 °C 360 CERAMIC BGA BGA360,19X19,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 25 mm 25 mm IBM MICROELECTRONICS BGA 360 not_compliant 3A991.A.2 8542.31.00.01
IBM25PPC750L-EB0B466W
 IBM 		Check for Price Obsolete 32 466 MHz 64 32 100 MHz YES 2.05 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 2.1 V 2 V OTHER S-CBGA-B360 Not Qualified 85 °C 360 CERAMIC, METAL-SEALED COFIRED BGA SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 3.2 mm 25 mm 25 mm IBM MICROELECTRONICS BGA 360 unknown 3A991.A.2 8542.31.00.01 BGA,
IBM25PPC750L-GB375C2R
 IBM 		Check for Price No No Contact Manufacturer 32 375 MHz 64 32 100 MHz YES 2.1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT 2.2 V 2 V S-XBGA-B360 Not Qualified 1 105 °C -40 °C 360 CERAMIC BGA BGA360,19X19,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 25 mm 25 mm IBM MICROELECTRONICS BGA 360 not_compliant 3A991.A.2 8542.31.00.01
IBM25PPC750L-GB500AD2SR
 IBM 		Check for Price No No Contact Manufacturer 32 500 MHz 64 32 100 MHz YES 2.1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT 2.2 V 2 V S-XBGA-B360 Not Qualified 1 105 °C -40 °C 360 CERAMIC BGA BGA360,19X19,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 25 mm 25 mm IBM MICROELECTRONICS BGA 360 not_compliant 3A991.A.2 8542.31.00.01
IBM25PPC750L-GB533DD2R
 IBM 		Check for Price No No Contact Manufacturer 32 533 MHz 64 32 100 MHz YES 2.1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT 2.2 V 2 V S-XBGA-B360 Not Qualified 1 105 °C -40 °C 360 CERAMIC BGA BGA360,19X19,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 25 mm 25 mm IBM MICROELECTRONICS BGA 360 not_compliant 3A991.A.2 8542.31.00.01
IBM25EMPPC750LEBA366
 IBM 		Check for Price No Contact Manufacturer 32 366 MHz 64 32 100 MHz YES 2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT 2.1 V 1.9 V S-XBGA-B360 Not Qualified e0 65 °C -40 °C 360 CERAMIC BGA BGA360,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM IBM MICROELECTRONICS unknown 3A991.A.2 8542.31.00.01 BGA, BGA360,19X19,50
IBM25PPC750L-DB0C300W
 IBM 		Check for Price No Obsolete 32 300 MHz 64 32 100 MHz YES 2.05 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 2.1 V 2 V OTHER S-CBGA-B360 Not Qualified e0 105 °C 360 CERAMIC, METAL-SEALED COFIRED BGA BGA360,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 3.2 mm 25 mm 25 mm IBM MICROELECTRONICS BGA 360 unknown 3A991.A.2 8542.31.00.01 BGA, BGA360,19X19,50
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