Findchips: Parametric Search Results for s10123

Parametric results for: s10123 under Network Interfaces

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		S10123PBI Applied Micro Circuits Corporation
		S10123-256Q-01 Hamamatsu Photonics
		S10123-1024Q-01 Hamamatsu Photonics
		S10123-512Q-01 Hamamatsu Photonics
		S10123PSI MACOM
		S10123-256Q Hamamatsu Photonics
		S10123-512Q Hamamatsu Photonics
		S10123PSI Applied Micro Circuits Corporation
		S10123PBI MACOM
		S10123-1024Q Hamamatsu Photonics

			Most Relevant						Technical							Compliance		Operating Conditions				Physical												Dimensions		Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Pixel Size	Horizontal Pixel	Vertical Pixel	Spectral Response (nm)	Housing	Sensors/Transducers Type	Output Type	Number of Functions	Operating Current-Max	Supply Voltage-Max	Supply Voltage-Min	Technology	JESD-609 Code	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Array Type	Mounting Feature	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Shape/Style	Package Style	Terminal Finish	Terminal Form	Terminal Position	Termination Type	Body Breadth	Body Length or Diameter	Ihs Manufacturer	Package Description	Reach Compliance Code	Supply Voltage-Nom	Telecom IC Type	HTS Code

Check for Price

Yes

Transferred

YES

CMOS

S-PBGA-B324

NOT SPECIFIED

324

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

APPLIED MICRO CIRCUITS CORP

19 X 19 MM, 1 MM PITCH, FBGA-324

compliant

1.2 V

INTERFACE CIRCUIT

Check for Price

Yes

Active

IMAGE SENSOR,CMOS

GOLD OVER NICKEL

HAMAMATSU PHOTONICS KK

unknown

Check for Price

Yes

Active

IMAGE SENSOR,CMOS

GOLD OVER NICKEL

HAMAMATSU PHOTONICS KK

unknown

Check for Price

Yes

Active

IMAGE SENSOR,CMOS

GOLD OVER NICKEL

HAMAMATSU PHOTONICS KK

unknown

Check for Price

Yes

Obsolete

YES

CMOS

S-PBGA-B324

NOT SPECIFIED

324

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

M/A-COM TECHNOLOGY SOLUTIONS INC

BGA,

compliant

1.2 V

INTERFACE CIRCUIT

Check for Price

Yes

Active

25X500 µm

256

200-1000

CERAMIC

IMAGE SENSOR,CMOS

CURRENT OUTPUT

5.25 mA

5.25 V

4.75 V

65 °C

-5 °C

LINEAR

THROUGH HOLE MOUNT

RECTANGULAR

SOLDER

10.16 inch

31.75 mm

HAMAMATSU PHOTONICS KK

unknown

Check for Price

Yes

Active

25X500 µm

512

200-1000

CERAMIC

IMAGE SENSOR,CMOS

CURRENT OUTPUT

5.25 mA

5.25 V

4.75 V

65 °C

-5 °C

LINEAR

THROUGH HOLE MOUNT

RECTANGULAR

SOLDER

10.16 inch

31.75 mm

HAMAMATSU PHOTONICS KK

unknown

Check for Price

Yes

Transferred

YES

CMOS

S-PBGA-B324

NOT SPECIFIED

324

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

APPLIED MICRO CIRCUITS CORP

19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324

compliant

1.2 V

INTERFACE CIRCUIT

Check for Price

Yes

Active

YES

CMOS

S-PBGA-B324

NOT SPECIFIED

324

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

M/A-COM TECHNOLOGY SOLUTIONS INC

BGA,

compliant

1.2 V

INTERFACE CIRCUIT

8542.39.00.01

Check for Price

Yes

Active

25X500 µm

1024

200-1000

CERAMIC

IMAGE SENSOR,CMOS

CURRENT OUTPUT

5.25 mA

5.25 V

4.75 V

65 °C

-5 °C

LINEAR

THROUGH HOLE MOUNT

RECTANGULAR

SOLDER

10.16 inch

40.6 mm

HAMAMATSU PHOTONICS KK

unknown

Compare

S10123PBI

Applied Micro Circuits Corporation

Check for Price

Yes

Transferred

YES

CMOS

S-PBGA-B324

NOT SPECIFIED

324

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

APPLIED MICRO CIRCUITS CORP

19 X 19 MM, 1 MM PITCH, FBGA-324

compliant

1.2 V

INTERFACE CIRCUIT

S10123-256Q-01

Hamamatsu Photonics

Check for Price

Yes

Active

IMAGE SENSOR,CMOS

GOLD OVER NICKEL

HAMAMATSU PHOTONICS KK

unknown

S10123-1024Q-01

Hamamatsu Photonics

Check for Price

Yes

Active

IMAGE SENSOR,CMOS

GOLD OVER NICKEL

HAMAMATSU PHOTONICS KK

unknown

S10123-512Q-01

Hamamatsu Photonics

Check for Price

Yes

Active

IMAGE SENSOR,CMOS

GOLD OVER NICKEL

HAMAMATSU PHOTONICS KK

unknown

S10123PSI

MACOM

Check for Price

Yes

Obsolete

YES

CMOS

S-PBGA-B324

NOT SPECIFIED

324

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

M/A-COM TECHNOLOGY SOLUTIONS INC

BGA,

compliant

1.2 V

INTERFACE CIRCUIT

S10123-256Q

Hamamatsu Photonics

Check for Price

Yes

Active

25X500 µm

256

200-1000

CERAMIC

IMAGE SENSOR,CMOS

CURRENT OUTPUT

5.25 mA

5.25 V

4.75 V

65 °C

-5 °C

LINEAR

THROUGH HOLE MOUNT

RECTANGULAR

SOLDER

10.16 inch

31.75 mm

HAMAMATSU PHOTONICS KK

unknown

S10123-512Q

Hamamatsu Photonics

Check for Price

Yes

Active

25X500 µm

512

200-1000

CERAMIC

IMAGE SENSOR,CMOS

CURRENT OUTPUT

5.25 mA

5.25 V

4.75 V

65 °C

-5 °C

LINEAR

THROUGH HOLE MOUNT

RECTANGULAR

SOLDER

10.16 inch

31.75 mm

HAMAMATSU PHOTONICS KK

unknown

S10123PSI

Applied Micro Circuits Corporation

Check for Price

Yes

Transferred

YES

CMOS

S-PBGA-B324

NOT SPECIFIED

324

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

APPLIED MICRO CIRCUITS CORP

19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324

compliant

1.2 V

INTERFACE CIRCUIT

S10123PBI

MACOM

Check for Price

Yes

Active

YES

CMOS

S-PBGA-B324

NOT SPECIFIED

324

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

M/A-COM TECHNOLOGY SOLUTIONS INC

BGA,

compliant

1.2 V

INTERFACE CIRCUIT

8542.39.00.01

S10123-1024Q

Hamamatsu Photonics

Check for Price

Yes

Active

25X500 µm

1024

200-1000

CERAMIC

IMAGE SENSOR,CMOS

CURRENT OUTPUT

5.25 mA

5.25 V

4.75 V

65 °C

-5 °C

LINEAR

THROUGH HOLE MOUNT

RECTANGULAR

SOLDER

10.16 inch

40.6 mm

HAMAMATSU PHOTONICS KK

unknown