Parametric results for: serial eeprom under Other Memory ICs

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Memory IC Type: SPI BUS SERIAL EEPROM
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MR25H256ACDFR
Everspin Technologies
Check for Price Yes Active 262.144 kbit 8 32KX8 3 V SPI BUS SERIAL EEPROM 1 32000 32.768 k SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-N8 3 85 °C -40 °C 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 900 µm 6 mm 5 mm EVERSPIN TECHNOLOGIES INC HVSON, compliant EAR99 8542.32.00.71 Everspin Technologies
MR25H256APDF
Everspin Technologies
Check for Price Yes Active 262.144 kbit 8 32KX8 3 V SPI BUS SERIAL EEPROM 1 32000 32.768 k SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-N8 3 85 °C -40 °C NOT SPECIFIED AEC-Q100 NOT SPECIFIED 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 900 µm 6 mm 5 mm EVERSPIN TECHNOLOGIES INC HVSON, compliant EAR99 8542.32.00.71 Everspin Technologies
MR25H256AMDFR
Everspin Technologies
Check for Price Yes Active 262.144 kbit 8 32KX8 3.3 V SPI BUS SERIAL EEPROM 1 32000 32.768 k SYNCHRONOUS 3.6 V 3 V CMOS AUTOMOTIVE R-PDSO-N8 3 125 °C -40 °C AEC-Q100 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 900 µm 6 mm 5 mm EVERSPIN TECHNOLOGIES INC HVSON, compliant EAR99 8542.32.00.71 Everspin Technologies
MR25H256ACDF
Everspin Technologies
Check for Price Yes Active 262.144 kbit 8 32KX8 3 V SPI BUS SERIAL EEPROM 1 32000 32.768 k SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-N8 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 900 µm 6 mm 5 mm EVERSPIN TECHNOLOGIES INC HVSON, compliant EAR99 8542.32.00.71 Everspin Technologies
MR25H256AMDF
Everspin Technologies
Check for Price Yes Active 262.144 kbit 8 32KX8 3.3 V SPI BUS SERIAL EEPROM 1 32000 32.768 k SYNCHRONOUS 3.6 V 3 V CMOS AUTOMOTIVE R-PDSO-N8 3 125 °C -40 °C NOT SPECIFIED AEC-Q100 NOT SPECIFIED 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 900 µm 6 mm 5 mm EVERSPIN TECHNOLOGIES INC HVSON, compliant EAR99 8542.32.00.71 Everspin Technologies
MR25H256APDFR
Everspin Technologies
Check for Price Yes Active 262.144 kbit 8 32KX8 3 V SPI BUS SERIAL EEPROM 1 32000 32.768 k SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-N8 3 85 °C -40 °C AEC-Q100 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 900 µm 6 mm 5 mm EVERSPIN TECHNOLOGIES INC HVSON, compliant EAR99 8542.32.00.71 Everspin Technologies