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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: spc5125yvn400 under Microprocessors

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Manufacturer Part Number: spc5125yvn400

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Select Parts		Part Number

		SPC5125YVN400R NXP Semiconductors
		SPC5125YVN400 Freescale Semiconductor
		SPC5125YVN400R Freescale Semiconductor
		SPC5125YVN400 NXP Semiconductors

				Most Relevant			Technical		Compliance			Operating Conditions						Physical										Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	Surface Mount	uPs/uCs/Peripheral ICs Type	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Yes

Active

32

400 MHz

YES

MICROPROCESSOR, RISC

INDUSTRIAL

S-PBGA-B324

Not Qualified

e2

3

85 °C

-40 °C

260

AEC-Q100

40

324

PLASTIC/EPOXY

BGA

BGA324,22X22,40

SQUARE

GRID ARRAY

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

NXP SEMICONDUCTORS

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Yes

Transferred

32

400 MHz

YES

MICROPROCESSOR, RISC

INDUSTRIAL

S-PBGA-B324

Not Qualified

e2

3

85 °C

-40 °C

260

AEC-Q100

40

324

PLASTIC/EPOXY

BGA

BGA324,22X22,40

SQUARE

GRID ARRAY

TIN SILVER

BALL

1 mm

BOTTOM

FREESCALE SEMICONDUCTOR INC

unknown

NXP

Check for Price

Yes

Yes

Transferred

32

400 MHz

YES

MICROPROCESSOR, RISC

INDUSTRIAL

S-PBGA-B324

Not Qualified

e2

3

85 °C

-40 °C

260

AEC-Q100

40

324

PLASTIC/EPOXY

BGA

BGA324,22X22,40

SQUARE

GRID ARRAY

TIN SILVER

BALL

1 mm

BOTTOM

FREESCALE SEMICONDUCTOR INC

unknown

NXP

Check for Price

Yes

Active

32

400 MHz

YES

MICROPROCESSOR, RISC

INDUSTRIAL

S-PBGA-B324

Not Qualified

e2

3

85 °C

-40 °C

260

AEC-Q100

40

324

PLASTIC/EPOXY

BGA

BGA324,22X22,40

SQUARE

GRID ARRAY

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

NXP SEMICONDUCTORS

compliant

3A991.A.2

8542.31.00.01

NXP

Compare

NXP Semiconductors

Yes

Active

32

400 MHz

YES

MICROPROCESSOR, RISC

INDUSTRIAL

S-PBGA-B324

Not Qualified

e2

3

85 °C

-40 °C

260

AEC-Q100

40

324

PLASTIC/EPOXY

BGA

BGA324,22X22,40

SQUARE

GRID ARRAY

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

NXP SEMICONDUCTORS

compliant

3A991.A.2

8542.31.00.01

NXP

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

Yes

Yes

Transferred

32

400 MHz

YES

MICROPROCESSOR, RISC

INDUSTRIAL

S-PBGA-B324

Not Qualified

e2

3

85 °C

-40 °C

260

AEC-Q100

40

324

PLASTIC/EPOXY

BGA

BGA324,22X22,40

SQUARE

GRID ARRAY

TIN SILVER

BALL

1 mm

BOTTOM

FREESCALE SEMICONDUCTOR INC

unknown

NXP

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

Yes

Yes

Transferred

32

400 MHz

YES

MICROPROCESSOR, RISC

INDUSTRIAL

S-PBGA-B324

Not Qualified

e2

3

85 °C

-40 °C

260

AEC-Q100

40

324

PLASTIC/EPOXY

BGA

BGA324,22X22,40

SQUARE

GRID ARRAY

TIN SILVER

BALL

1 mm

BOTTOM

FREESCALE SEMICONDUCTOR INC

unknown

NXP

NXP Semiconductors

Check for Price

Yes

Active

32

400 MHz

YES

MICROPROCESSOR, RISC

INDUSTRIAL

S-PBGA-B324

Not Qualified

e2

3

85 °C

-40 °C

260

AEC-Q100

40

324

PLASTIC/EPOXY

BGA

BGA324,22X22,40

SQUARE

GRID ARRAY

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

NXP SEMICONDUCTORS

compliant

3A991.A.2

8542.31.00.01

NXP