Parametric results for: spc5566mvr144 under Microcontrollers

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Manufacturer Part Number: spc5566mvr144
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SPC5566MVR144
NXP Semiconductors
$77.6718 Yes Active 32 144 MHz 3145728 131072 E200 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER, RISC CMOS NO YES YES 8 YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant 3A991.A.2 8542.31.00.01
SPC5566MVR144R
Freescale Semiconductor
Check for Price Yes Yes Obsolete 32 147 MHz 3145728 131072 E200 YES CMOS FLASH 820 mA AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY BGA BGA416,26X26,40 SQUARE GRID ARRAY TIN SILVER COPPER BALL 1 mm BOTTOM FREESCALE SEMICONDUCTOR INC unknown
SPC5566MVR144
Freescale Semiconductor
Check for Price Yes Yes Transferred 32 144 MHz 3145728 131072 E200 32 24 20 MHz YES 1.5 V MICROCONTROLLER, RISC CMOS NO YES YES 8 YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant