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04021J1R1ABSTR500
Kyocera AVX Components
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$0.3589 | Yes | Active | 1.1 pF | 100 V | 4.5455 % | 0402 | 4.5455 % | SURFACE MOUNT | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 | ||||||
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04021J1R7ABSTR500
Kyocera AVX Components
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$0.3589 | Yes | Active | 1.7 pF | 100 V | 2.9412 % | 0402 | 2.9412 % | SURFACE MOUNT | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 | ||||||
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04021J0R3ZBSTR
Kyocera AVX Components
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$0.4669 | Yes | Yes | Active | 0.3 pF | 100 V | 3.3333 % | 0402 | J | 3.3333 % | SURFACE MOUNT | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | CECC; IATF 16949 | 125 °C | -55 °C | 2 | SMT | TR, 13 Inch | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 | ||||
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04021J0R2ZBSTR
Kyocera AVX Components
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$0.4669 | Yes | Yes | Active | 0.2 pF | 100 V | 5 % | 0402 | J | 5 % | SURFACE MOUNT | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | CECC; IATF 16949 | 125 °C | -55 °C | 2 | SMT | TR, 13 Inch | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 | ||||
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04021J0R4ZBSTR
Kyocera AVX Components
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$0.4669 | Yes | Yes | Active | 0.4 pF | 100 V | 2.5 % | 0402 | J | 2.5 % | SURFACE MOUNT | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | CECC; IATF 16949 | 125 °C | -55 °C | 2 | SMT | TR, 13 Inch | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 | ||||
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04021J0R1ZBSTR
Kyocera AVX Components
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$0.4669 | Yes | Yes | Active | 0.1 pF | 100 V | 10 % | 0402 | J | 10 % | SURFACE MOUNT | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | CECC; IATF 16949 | 125 °C | -55 °C | 2 | SMT | TR, 13 Inch | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 | ||||
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04021J0R5ZBSTR
Kyocera AVX Components
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$0.4669 | Yes | Yes | Active | 0.5 pF | 100 V | 2 % | 0402 | J | 2 % | SURFACE MOUNT | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | SMT | TR, 13 Inch | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 | |||||
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04023J0R2ZBSTR
Kyocera AVX Components
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$0.5017 | Yes | Active | 0.2 pF | 25 V | 5 % | 0402 | J | 5 % | SURFACE MOUNT | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | CECC; IATF 16949 | 125 °C | -55 °C | 2 | SMT | TR, 13 Inch | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 | |||||
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04025J6R2ABSTR500
Kyocera AVX Components
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$0.5108 | Yes | Active | 6.2 pF | 50 V | 0.8065 % | 0402 | J | 0.8065 % | SURFACE MOUNT | No | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 | ||||
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04025J6R8ABSTR500
Kyocera AVX Components
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$0.5108 | Yes | Active | 6.8 pF | 50 V | 0.7353 % | 0402 | J | 0.7353 % | SURFACE MOUNT | SILICON DIOXIDE AND OXYNITRIDE | FILM CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 400 µm | 1 mm | 550 µm | AVX CORP | , 0402 | compliant | EAR99 | 8532.25.00.45 |