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Manufacturer Part Number: t1024nse7kqa

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Select Parts		Part Number

		T1024NSE7KQA NXP Semiconductors
		T1024NSE7KQA Freescale Semiconductor

				Most Relevant		Technical					Compliance		Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$86.7535

Yes

Active

YES

1 V

SoC

CMOS

1.03 V

970 mV

OTHER

S-PBGA-B780

105 °C

250

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

2.07 mm

23 mm

NXP SEMICONDUCTORS

HFBGA, BGA780,28X28,32

compliant

5A002.A.1

8542.31.00.01

NXP

Check for Price

Yes

Active

YES

1 V

SoC

CMOS

1.03 V

970 mV

S-PBGA-B780

105 °C

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BALL

800 µm

BOTTOM

2.07 mm

23 mm

FREESCALE SEMICONDUCTOR INC

23 X 23 MM, 2.07 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FCBGA-780

unknown

NXP

Compare

T1024NSE7KQA

NXP Semiconductors

$86.7535

Yes

Active

YES

1 V

SoC

CMOS

1.03 V

970 mV

OTHER

S-PBGA-B780

105 °C

250

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

2.07 mm

23 mm

NXP SEMICONDUCTORS

HFBGA, BGA780,28X28,32

compliant

5A002.A.1

8542.31.00.01

NXP

T1024NSE7KQA

Freescale Semiconductor

Check for Price

Yes

Active

YES

1 V

SoC

CMOS

1.03 V

970 mV

S-PBGA-B780

105 °C

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BALL

800 µm

BOTTOM

2.07 mm

23 mm

FREESCALE SEMICONDUCTOR INC

23 X 23 MM, 2.07 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FCBGA-780

unknown

NXP