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Parametric results for: t1024nsn7kna under Microprocessors

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Manufacturer Part Number: t1024nsn7kna

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Select Parts		Part Number

		T1024NSN7KNA Freescale Semiconductor
		T1024NSN7KNA NXP Semiconductors

				Most Relevant		Technical					Compliance		Operating Conditions		Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code

Check for Price

Yes

Obsolete

YES

1 V

SoC

CMOS

1.03 V

970 mV

S-PBGA-B780

105 °C

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

2.07 mm

23 mm

FREESCALE SEMICONDUCTOR INC

23 X 23 MM, 2.07 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FCBGA-780

compliant

Check for Price

Yes

Obsolete

YES

1 V

SoC

CMOS

1.03 V

970 mV

OTHER

S-PBGA-B780

105 °C

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

2.07 mm

23 mm

NXP SEMICONDUCTORS

FCBGA-780

unknown

8542.31.00.01

Compare

T1024NSN7KNA

Freescale Semiconductor

Check for Price

Yes

Obsolete

YES

1 V

SoC

CMOS

1.03 V

970 mV

S-PBGA-B780

105 °C

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

2.07 mm

23 mm

FREESCALE SEMICONDUCTOR INC

23 X 23 MM, 2.07 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FCBGA-780

compliant

T1024NSN7KNA

NXP Semiconductors

Check for Price

Yes

Obsolete

YES

1 V

SoC

CMOS

1.03 V

970 mV

OTHER

S-PBGA-B780

105 °C

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

2.07 mm

23 mm

NXP SEMICONDUCTORS

FCBGA-780

unknown

8542.31.00.01