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Parametric » Power Circuits » Power Management Circuits

Parametric results for: tc54vn2702ecb713 under Power Management Circuits

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Select Parts		Part Number

		TC54VN2702ECB713 Microchip Technology Inc
		TC54VN2702ECB713 Telcom Semiconductor Inc

				Most Relevant								Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Supply Current-Max (Isup)	Threshold Voltage-Nom	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Technology	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Yes

Yes

Active

2 V

700 mV

10 V

4 µA

+2.7V

1

YES

NO

VOLTAGE DETECTOR

1

CMOS

INDUSTRIAL

R-PDSO-G3

e3

Not Qualified

1

85 °C

-40 °C

260

TS 16949

3

PLASTIC/EPOXY

LSSOP

TO-236

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

YES

MATTE TIN

GULL WING

950 µm

DUAL

1.5 mm

2.9 mm

1.45 mm

MICROCHIP TECHNOLOGY INC

PLASTIC, EIAJ, SC-59, SOT-23A, 3 PIN

compliant

EAR99

8542.39.00.01

Microchip

Check for Price

No

Transferred

1.5 V

10 V

4.2 µA

+2.7V

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

CMOS

INDUSTRIAL

R-PDSO-G3

e0

Not Qualified

85 °C

-40 °C

3

PLASTIC/EPOXY

TO-236

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

DUAL

TELCOM SEMICONDUCTOR INC

unknown

Compare

TC54VN2702ECB713

Microchip Technology Inc

Yes

Yes

Active

2 V

700 mV

10 V

4 µA

+2.7V

1

YES

NO

VOLTAGE DETECTOR

1

CMOS

INDUSTRIAL

R-PDSO-G3

e3

Not Qualified

1

85 °C

-40 °C

260

TS 16949

3

PLASTIC/EPOXY

LSSOP

TO-236

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

YES

MATTE TIN

GULL WING

950 µm

DUAL

1.5 mm

2.9 mm

1.45 mm

MICROCHIP TECHNOLOGY INC

PLASTIC, EIAJ, SC-59, SOT-23A, 3 PIN

compliant

EAR99

8542.39.00.01

Microchip

TC54VN2702ECB713

Telcom Semiconductor Inc

Check for Price

No

Transferred

1.5 V

10 V

4.2 µA

+2.7V

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

CMOS

INDUSTRIAL

R-PDSO-G3

e0

Not Qualified

85 °C

-40 °C

3

PLASTIC/EPOXY

TO-236

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

DUAL

TELCOM SEMICONDUCTOR INC

unknown