Findchips.com

Register or Sign In

Parametric » Microcontrollers and Processors » Digital Signal Processors

Parametric results for: tms320c6416ezlz6e3 under Digital Signal Processors

Select parts from the table below to compare.

Compare


	Part Number

Microcontrollers and Processors

TMS320C6416EZLZ6E3

Texas Instruments

		Most Relevant						Technical										Compliance		Operating Conditions	Physical								Dimensions			Other
Composite Price	Part Life Cycle Code	Bit Size	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Barrel Shifter	Boundary Scan	Format	Internal Bus Architecture	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

32

64

23

75.75 MHz

YES

1.4 V

DIGITAL SIGNAL PROCESSOR, OTHER

CMOS

ALSO REQUIRES 3.3V SUPPLY

NO

YES

FIXED POINT

MULTIPLE

YES

1.44 V

1.36 V

S-PBGA-B532

Not Qualified

90 °C

532

PLASTIC/EPOXY

HFBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BALL

800 µm

BOTTOM

3.3 mm

23 mm

23 mm

TEXAS INSTRUMENTS INC

BGA

HFBGA,

532

unknown

3A991.A.2

8542.31.00.01

Compare

Microcontrollers and Processors

TMS320C6416EZLZ6E3

Texas Instruments

Check for Price

Obsolete

32

64

23

75.75 MHz

YES

1.4 V

DIGITAL SIGNAL PROCESSOR, OTHER

CMOS

ALSO REQUIRES 3.3V SUPPLY

NO

YES

FIXED POINT

MULTIPLE

YES

1.44 V

1.36 V

S-PBGA-B532

Not Qualified

90 °C

532

PLASTIC/EPOXY

HFBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BALL

800 µm

BOTTOM

3.3 mm

23 mm

23 mm

TEXAS INSTRUMENTS INC

BGA

HFBGA,

532

unknown

3A991.A.2

8542.31.00.01