Findchips: Parametric Search Results for tspc603rvgh8lc


Select Parts		Part Number

		TSPC603RVGH8LC Atmel Corporation
		TSPC603RVGH8LC Teledyne e2v

		Most Relevant							Technical									Compliance		Operating Conditions		Physical									Dimensions			Other
Composite Price	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

200 MHz

66.7 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.08 mm

21 mm

ATMEL CORP

BGA

21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255

255

unknown

3A991.A.2

8542.31.00.01

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Obsolete

200 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

INDUSTRIAL

S-CBGA-B255

Not Qualified

110 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

BGA255,16X16,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.08 mm

21 mm

TELEDYNE E2V (UK) LTD

BGA

21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255

255

unknown

3A991.A.2

8542.31.00.01

Compare

TSPC603RVGH8LC

Atmel Corporation

Check for Price

Transferred

200 MHz

66.7 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.08 mm

21 mm

ATMEL CORP

BGA

21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255

255

unknown

3A991.A.2

8542.31.00.01

TSPC603RVGH8LC

Teledyne e2v

Check for Price

Obsolete

200 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

INDUSTRIAL

S-CBGA-B255

Not Qualified

110 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

BGA255,16X16,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.08 mm

21 mm

TELEDYNE E2V (UK) LTD

BGA

21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255

255

unknown

3A991.A.2

8542.31.00.01

Parametric results for: tspc603rvgh8lc under Microprocessors