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Manufacturer Part Number: xczu19eg2ffvc1760e

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Select Parts		Part Number

		XCZU19EG-2FFVC1760E AMD Xilinx
		XCZU19EG-2FFVC1760E AMD

				Most Relevant			Technical				Compliance		Operating Conditions				Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Samacsys Manufacturer

Check for Price

Yes

Transferred

YES

850 mV

MICROPROCESSOR CIRCUIT

CMOS

876 mV

825 mV

OTHER

R-PBGA-B1760

100 °C

245

1760

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

3.71 mm

42.5 mm

XILINX INC

FCBGA-1760

compliant

5A002.A.4

8542.39.00.01

2017-02-15

Check for Price

Yes

Active

YES

850 mV

MICROPROCESSOR CIRCUIT

CMOS

876 mV

825 mV

OTHER

R-PBGA-B1760

100 °C

1760

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

3.71 mm

42.5 mm

ADVANCED MICRO DEVICES INC

FCBGA-1760

compliant

AMD

Compare

XCZU19EG-2FFVC1760E

AMD Xilinx

Check for Price

Yes

Transferred

YES

850 mV

MICROPROCESSOR CIRCUIT

CMOS

876 mV

825 mV

OTHER

R-PBGA-B1760

100 °C

245

1760

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

3.71 mm

42.5 mm

XILINX INC

FCBGA-1760

compliant

5A002.A.4

8542.39.00.01

2017-02-15

XCZU19EG-2FFVC1760E

AMD

Check for Price

Yes

Active

YES

850 mV

MICROPROCESSOR CIRCUIT

CMOS

876 mV

825 mV

OTHER

R-PBGA-B1760

100 °C

1760

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

3.71 mm

42.5 mm

ADVANCED MICRO DEVICES INC

FCBGA-1760

compliant

AMD