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Parametric results for: xq7z020-1cl400i under Other uPs/uCs/Peripheral ICs

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Manufacturer Part Number: xq7z0201cl400i

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Select Parts		Part Number

		XQ7Z020-1CL400I AMD Xilinx
		XQ7Z020-1CL400I AMD

			Most Relevant		Technical		Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	uPs/uCs/Peripheral ICs Type	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

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Transferred

YES

PROGRAMMABLE SoC

CMOS

INDUSTRIAL

S-PBGA-B400

Not Qualified

100 °C

-40 °C

NOT SPECIFIED

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.6 mm

17 mm

XILINX INC

WCBGA-400

not_compliant

EAR99

8542.39.00.01

Check for Price

Active

YES

PROGRAMMABLE SoC

CMOS

INDUSTRIAL

S-PBGA-B400

Not Qualified

100 °C

-40 °C

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN LEAD

BALL

800 µm

BOTTOM

1.6 mm

17 mm

ADVANCED MICRO DEVICES INC

WCBGA-400

compliant

AMD

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XQ7Z020-1CL400I

AMD Xilinx

Check for Price

Transferred

YES

PROGRAMMABLE SoC

CMOS

INDUSTRIAL

S-PBGA-B400

Not Qualified

100 °C

-40 °C

NOT SPECIFIED

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.6 mm

17 mm

XILINX INC

WCBGA-400

not_compliant

EAR99

8542.39.00.01

XQ7Z020-1CL400I

AMD

Check for Price

Active

YES

PROGRAMMABLE SoC

CMOS

INDUSTRIAL

S-PBGA-B400

Not Qualified

100 °C

-40 °C

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN LEAD

BALL

800 µm

BOTTOM

1.6 mm

17 mm

ADVANCED MICRO DEVICES INC

WCBGA-400

compliant

AMD