Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
SIGC158T170R3X1SA2
DISTI #
SIGC158T170R3X1SA2
|
Infineon Technologies AG | IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC158T170R3X1SA2) RoHS: Not Compliant Min Qty: 20 Package Multiple: 1 Container: Waffle Pack SIGC158T170R3X1SA2 Part Details | 0 | RFQ SIGC158T170R3X1SA2 Part Details | ||
SIGC158T170R3EX1SA3
DISTI #
SIGC158T170R3EX1SA
|
Infineon Technologies AG | IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC158T170R3EX1SA) RoHS: Compliant Min Qty: 1431 Package Multiple: 1 Lead time: 20 Weeks, 0 Days Container: Waffle Pack SIGC158T170R3EX1SA3 Part Details | 0 | RFQ SIGC158T170R3EX1SA3 Part Details |