Part # | Manufacturer | Description | Stock | Price | Buy | |
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SIGC40T60R3X1SA4
DISTI #
SIGC40T60R3X1SA4
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Infineon Technologies AG | Trans IGBT Chip N-CH 600V DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC40T60R3X1SA4) RoHS: Not Compliant Min Qty: 91 Package Multiple: 1 Container: Waffle Pack SIGC40T60R3X1SA4 Part Details | 0 | RFQ SIGC40T60R3X1SA4 Part Details | ||
SIGC40T60R3EX1SA3
DISTI #
SIGC40T60R3EX1SA3
|
Infineon Technologies AG | IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC40T60R3EX1SA3) RoHS: Compliant Min Qty: 5994 Package Multiple: 1 Lead time: 20 Weeks, 0 Days Container: Waffle Pack SIGC40T60R3EX1SA3 Part Details | 0 |
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$5.2307 / $5.9779 | Buy Now SIGC40T60R3EX1SA3 Part Details |