Part # | Manufacturer | Description | Stock | Price | Buy | |
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SIDC02D60F6X1SA1
DISTI #
SIDC02D60F6X1SA1
|
Infineon Technologies AG | Diode Switching 3A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC02D60F6X1SA1) RoHS: Compliant Min Qty: 2370 Package Multiple: 1 Container: Waffle Pack SIDC02D60F6X1SA1 Part Details | 0 | RFQ SIDC02D60F6X1SA1 Part Details |