Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
SIGC186T170R3X1SA3
DISTI #
SIGC186T170R3X1SA3
|
Infineon Technologies AG | Trans IGBT Chip N-CH 1.7KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC186T170R3X1SA3) RoHS: Not Compliant Min Qty: 17 Package Multiple: 1 Container: Waffle Pack SIGC186T170R3X1SA3 Part Details | 0 | RFQ SIGC186T170R3X1SA3 Part Details | ||
SIGC186T170R3EX1SA
DISTI #
SIGC186T170R3EX1SA
|
Infineon Technologies AG | IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC186T170R3EX1SA) RoHS: Compliant Min Qty: 1233 Package Multiple: 1 Container: Waffle Pack SIGC186T170R3EX1SA Part Details | 0 | RFQ SIGC186T170R3EX1SA Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
SIGC186T170R3EX1SA4
DISTI #
SP000522392
|
Infineon Technologies AG | (Alt: SP000522392) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 2 Weeks, 0 Days SIGC186T170R3EX1SA4 Part Details | EBV - 0 | Buy Now SIGC186T170R3EX1SA4 Part Details |