Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
SL2ICS5101EW/V7,00
DISTI #
SL2ICS5101EW/V7,00-ND
|
NXP Semiconductors | IC I-CODE SLI SMART LABEL DIE Lead time: 52 Weeks Container: Bulk SL2ICS5101EW/V7,00 Part Details | Temporarily Out of Stock | Buy Now SL2ICS5101EW/V7,00 Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
SL2ICS5101EW/V7,005
DISTI #
SL2ICS5101EW/V7,00
|
NXP Semiconductors | Dedicated Chip For Smart Lapel Applications FFC Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SL2ICS5101EW/V7,00) RoHS: Compliant Min Qty: 28477 Package Multiple: 28477 Container: Waffle Pack SL2ICS5101EW/V7,005 Part Details | 0 | RFQ SL2ICS5101EW/V7,005 Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
SL2ICS5101EW/V7,005
DISTI #
SL2ICS5101EW/V7,00
|
NXP Semiconductors | Dedicated Chip For Smart Lapel Applications FFC Wafer (Alt: SL2ICS5101EW/V7,00) RoHS: Compliant Min Qty: 28477 Package Multiple: 28477 Lead time: 27 Weeks, 0 Days SL2ICS5101EW/V7,005 Part Details | Silica - 0 | Buy Now SL2ICS5101EW/V7,005 Part Details |