Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
INTEL FOR LGA 775 TM
DISTI #
INTEL FOR LGA 775
|
ADLINK Technology Inc | HEAT SINK: MATERIAL:AL 6063 & CU CORE - Bulk (Alt: INTEL FOR LGA 775) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Container: Bulk INTEL FOR LGA 775 TM Part Details | 0 | RFQ INTEL FOR LGA 775 TM Part Details |