AGL600V2-FG256Y
vs
AGL250V2-FG144YI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B144
|
JESD-609 Code |
e0
|
e0
|
Length |
17 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Equivalent Gates |
600000
|
250000
|
Number of Inputs |
177
|
97
|
Number of Logic Cells |
13824
|
6144
|
Number of Outputs |
177
|
97
|
Number of Terminals |
256
|
144
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
600000 GATES
|
250000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.7 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
13 mm
|
Base Number Matches |
4
|
2
|
|
|
|
Compare AGL600V2-FG256Y with alternatives
Compare AGL250V2-FG144YI with alternatives