MC12022SLAP vs MC12018DR2 feature comparison

MC12022SLAP Motorola Semiconductor Products

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MC12018DR2 Freescale Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description DIP, DIP8,.3 SOP, SOP8,.25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature 128/129 DIVIDE RATIO SELECTION IS ALSO POSSIBLE
Family ECL
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e0 e0
Length 9.78 mm
Load Capacitance (CL) 8 pF
Logic IC Type PRESCALER PRESCALER
Max Frequency@Nom-Sup 1100000000 Hz 520000000 Hz
Number of Data/Clock Inputs 1
Number of Functions 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-EMITTER
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supply Current-Max (ICC) 6.5 mA
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO YES
Technology BIPOLAR ECL
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm
fmax-Min 1100 MHz
Base Number Matches 3 3

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