MPC870ZT80 vs MCF54450CVM180 feature comparison

MPC870ZT80 Motorola Mobility LLC

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MCF54450CVM180 Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA256,16X16,50 17 X 17 MM, ROHS COMPLIANT, MAPBGA-256
Pin Count 256 256
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 23 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 1.6 mm
Speed 80 MHz 180 MHz
Supply Voltage-Max 1.9 V 1.65 V
Supply Voltage-Min 1.7 V 1.35 V
Supply Voltage-Nom 1.8 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
ECCN Code 3A991.A.2
Samacsys Manufacturer NXP
Clock Frequency-Max 60 MHz
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC870ZT80 with alternatives

Compare MCF54450CVM180 with alternatives